Thermocompression bonding

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CPC
H01L2224/80203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80203Thermocompression bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,119,337
- Issue date Oct 15, 2024
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having bonding layers
- Patent number 12,046,579
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guide apparatus for transferring light-emitting devices onto a subs...
- Patent number 12,040,208
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the display device
- Patent number 12,002,815
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- Jihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatuses and methods involving diamond and GaN-bas...
- Patent number 11,961,837
- Issue date Apr 16, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Srabanti Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor devices, method for forming semico...
- Patent number 11,916,037
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack and integrated device structure including improved bondin...
- Patent number 11,869,859
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stacked dies
- Patent number 11,824,047
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally isolated silicon-based display
- Patent number 11,682,663
- Issue date Jun 20, 2023
- Meta Platforms Technologies, LLC
- Young Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,658,169
- Issue date May 23, 2023
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with re-fill layer
- Patent number 11,646,292
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked dies and method for fabricating t...
- Patent number 11,557,572
- Issue date Jan 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,462,496
- Issue date Oct 4, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015041
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...
- Publication number 20240387399
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240347512
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321854
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
- Publication number 20240321904
- Publication date Sep 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jihyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...
- Publication number 20240321817
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128194
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240120306
- Publication date Apr 11, 2024
- UNITED MICROELECTRONICS CORP.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Bonding Apparatus and Method of Manufacturing a Package Usin...
- Publication number 20240071982
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240063152
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jyun Yang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055406
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yeongseon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20240047389
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY D...
- Publication number 20240038697
- Publication date Feb 1, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240030179
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND METHOD FOR FORMING THE SAME
- Publication number 20240021549
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
- Publication number 20230420437
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD
- Publication number 20230387070
- Publication date Nov 30, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS

Thermocompression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer directly bonded to bonding pads on a plurality of dies

Die on die bonding structure

Method of manufacturing a semiconductor device

Method for fabricating semiconductor device with redistribution plugs

Bond pad with micro-protrusions for direct metallic bonding

3D integrations and methods of making thereof

Bonded structures with integrated passive component

Package having bonding layers

Guide apparatus for transferring light-emitting devices onto a subs...

Bonding structure and method thereof

Semiconductor product with interlocking metal-to-metal bonds and me...

Display device and method of manufacturing the display device

Semiconductor apparatuses and methods involving diamond and GaN-bas...

Semiconductor device and method of manufacturing

Method for bonding semiconductor devices, method for forming semico...

Low temperature hybrid bonding

Semiconductor device and method of stacking semiconductor die for s...

Die stack and integrated device structure including improved bondin...

Method for fabricating semiconductor device with stacked dies

Wafer on wafer bonding structure

Thermally isolated silicon-based display

Semiconductor device

Apparatus, system, and method for handling aligned wafer pairs

Method for fabricating semiconductor device with re-fill layer

Bonded structures with integrated passive component

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor device with stacked dies and method for fabricating t...

Semiconductor device

Hybrid interconnect for laser bonding using nanoporous metal tips

Semiconductor device and method of stacking semiconductor die for s...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

DIE ON DIE BONDING STRUCTURE

RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

PACKAGE

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE

IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...

BONDING STRUCTURE AND METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Device Bonding Apparatus and Method of Manufacturing a Package Usin...

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY D...

BONDING TOOL AND BONDING METHOD THEREOF

CONNECTOR AND METHOD FOR FORMING THE SAME

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE