Thermocompression bonding

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H01L2224/85203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85203Thermocompression bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 11,749,617
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,721,660
- Issue date Aug 8, 2023
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 11,621,678
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for through silicon die level interconnect
- Patent number 11,621,219
- Issue date Apr 4, 2023
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 11,538,717
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,495,570
- Issue date Nov 8, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 11,380,626
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including processor chip and memory chip
- Patent number 11,309,300
- Issue date Apr 19, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,276,666
- Issue date Mar 15, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planarization of semiconductor packages and structures resulting th...
- Patent number 11,127,644
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for shielding magnetically sensitive components
- Patent number 11,088,317
- Issue date Aug 10, 2021
- EVERSPIN TECHNOLOGIES, INC.
- Wenchin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer uniting method
- Patent number 10,916,466
- Issue date Feb 9, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 10,903,803
- Issue date Jan 26, 2021
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 10,861,741
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 10,818,609
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,707,184
- Issue date Jul 7, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for connecting inter-layer conductors and components in 3D...
- Patent number 10,660,214
- Issue date May 19, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and power amplifier module
- Patent number 10,594,271
- Issue date Mar 17, 2020
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Ribbon bonding tools, and methods of designing ribbon bonding tools
- Patent number 10,562,127
- Issue date Feb 18, 2020
- Kulicke and Soffa Industries, Inc.
- Bernard Poncelet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230361050
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HARRY-HAK-LAY CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230335528
- Publication date Oct 19, 2023
- NIPPON MICROMETAL COPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230215834
- Publication date Jul 6, 2023
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220328423
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- HARRY-HAK-LAY CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...
- Publication number 20220302073
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT
- Publication number 20220262715
- Publication date Aug 18, 2022
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
- Publication number 20220216193
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUPD WIRE BOND CAPILLARY DESIGN
- Publication number 20210111146
- Publication date Apr 15, 2021
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS
- Publication number 20210090940
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20210050321
- Publication date Feb 18, 2021
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210043582
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HARRY-HAK-LAY CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER UNITING METHOD
- Publication number 20200058537
- Publication date Feb 20, 2020
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200020642
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HARRY-HAK-LAY CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...
- Publication number 20190295983
- Publication date Sep 26, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND CONNECTION WITH INTERMEDIATE CONTACT STRUCTURE
- Publication number 20190051627
- Publication date Feb 14, 2019
- Intel Corporation
- Yong SHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
- Publication number 20180308821
- Publication date Oct 25, 2018
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES AND METHODS FOR SHIELDING MAGNETICALLY SENSITIVE COMPONENTS
- Publication number 20180205005
- Publication date Jul 19, 2018
- EVERSPIN TECHNOLOGIES, INC.
- Wenchin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180122654
- Publication date May 3, 2018
- RENESAS ELECTRONICS CORPORATION
- Haruhiko HARADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180040521
- Publication date Feb 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170345787
- Publication date Nov 30, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE CONNECTING METHOD AND TERMINAL
- Publication number 20170287869
- Publication date Oct 5, 2017
- Toyota Jidosha Kabushiki Kaisha
- Shuhei HORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170092605
- Publication date Mar 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS

Thermocompression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module with a first substrate, a second substrate and...

Semiconductor device and method of stacking semiconductor die for s...

Package structure and method for fabricating the same

Bonding wire for semiconductor devices

Semiconductor device and power amplifier module

Method and apparatus for through silicon die level interconnect

Electronic package for integrated circuits and related methods

Systems and methods for optimizing looping parameters and looping t...

Noble metal-coated silver wire for ball bonding and method for prod...

Package structure and method for fabricating the same

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor package including processor chip and memory chip

Systems and methods for optimizing looping parameters and looping t...

Planarization of semiconductor packages and structures resulting th...

Structures and methods for shielding magnetically sensitive components

Wafer uniting method

Semiconductor device and power amplifier module

Wire bond clamp design and lead frame capable of engaging with same

Electronic package for integrated circuits and related methods

Floating die package

Bonding wire for semiconductor device

Package structure and method for fabricating the same

Methods and apparatus for a semiconductor device having bi-material...

Bonding wire for semiconductor device

Thermal bonding sheet and thermal bonding sheet with dicing tape

Bonding wire having a silver alloy core, wire bonding method using...

Methods for connecting inter-layer conductors and components in 3D...

Bonding wire for semiconductor device

Semiconductor device and power amplifier module

Ribbon bonding tools, and methods of designing ribbon bonding tools

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICES

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

BONDING WIRE FOR SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT

SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP

CUPD WIRE BOND CAPILLARY DESIGN

FLOATING DIE PACKAGE

ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

WAFER UNITING METHOD

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...

WIRE BOND CONNECTION WITH INTERMEDIATE CONTACT STRUCTURE

SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

STRUCTURES AND METHODS FOR SHIELDING MAGNETICALLY SENSITIVE COMPONENTS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

SEMICONDUCTOR DEVICE

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

WIRE CONNECTING METHOD AND TERMINAL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE