Thermocompression bonding

Industry

CPC
H01L2224/82203

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82203Thermocompression bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,990,446
- Issue date May 21, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method and apparatus for through silicon die level interconnect
- Patent number 11,621,219
- Issue date Apr 4, 2023
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 11,587,901
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,552,045
- Issue date Jan 10, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,101,405
- Issue date Aug 24, 2021
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
LED with internally confined current injection area
- Patent number 10,593,832
- Issue date Mar 17, 2020
- Apple Inc.
- Kelly McGroddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
- Patent number 9,136,220
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
- Patent number 9,099,478
- Issue date Aug 4, 2015
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, photosensitive resin composition...
- Patent number 8,946,852
- Issue date Feb 3, 2015
- Toray Industries, Inc.
- Hiroyuki Niwa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High frequency flip chip package structure of polymer substrate
- Patent number 8,258,606
- Issue date Sep 4, 2012
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency flip chip package process of polymer substrate and s...
- Patent number 8,033,039
- Issue date Oct 11, 2011
- National Chiao Tung University
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20240321822
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20230145473
- Publication date May 11, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20220310545
- Publication date Sep 29, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT
- Publication number 20220262715
- Publication date Aug 18, 2022
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Chip Packages and a Chip Package
- Publication number 20220181295
- Publication date Jun 9, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20220052021
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS
- Publication number 20190057950
- Publication date Feb 21, 2019
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...
- Publication number 20130214379
- Publication date Aug 22, 2013
- TORAY INDUSTRIES, INC.
- Hiroyuki Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
- Publication number 20130069219
- Publication date Mar 21, 2013
- Shinko Electric Industries Co., Ltd.
- Kenta UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
- Publication number 20110186974
- Publication date Aug 4, 2011
- National Chiao Tung University
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
- Publication number 20100307798
- Publication date Dec 9, 2010
- Jamal S. Izadian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Frequency Flip Chip Package Process of Polymer Substrate and S...
- Publication number 20100248430
- Publication date Sep 30, 2010
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS

Thermocompression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming chip packages and a chip package having a chipse...

Semiconductor assemblies with redistribution structures for die sta...

LED with internally confined current injection area

Method and apparatus for through silicon die level interconnect

Semiconductor device with redistribution structure and method for f...

Semiconductor assemblies with redistribution structures for die sta...

LED with internally confined current injection area

Electronic module and method for producing same

LED with internally confined current injection area

Semiconductor package and method for manufacturing the semiconducto...

Semiconductor package and method for manufacturing the semiconducto...

Photosensitive resin composition, photosensitive resin composition...

High frequency flip chip package structure of polymer substrate

High frequency flip chip package process of polymer substrate and s...

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT

Method for Forming Chip Packages and a Chip Package

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...

HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE

UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES

High Frequency Flip Chip Package Process of Polymer Substrate and S...