Thermoelectric

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CPC
Y10S257/93

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S257/00Active solid-state devices

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Y10S257/93Thermoelectric

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Patents Grantslast 30 patents

Information Patent Grant
Thermoelectric element, method of manufacturing the same and semico...
- Patent number 9,917,240
- Issue date Mar 13, 2018
- Samsung Electronics Co., Ltd.
- Kwang-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for operating system for utilizing exhaust heat of vehicle
- Patent number 9,074,506
- Issue date Jul 7, 2015
- Hyundai Motor Company
- Ho-Chan An
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic device including thermal sensor and peltier cooler and r...
- Patent number 8,952,480
- Issue date Feb 10, 2015
- STMicroelectronics Asia Pacific PTE Ltd.
- PraveenKumar Radhakrishnan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermoelectric conversion material
- Patent number 8,802,963
- Issue date Aug 12, 2014
- Hitachi, Ltd.
- Tadashi Fujieda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film semiconductor device
- Patent number 8,399,951
- Issue date Mar 19, 2013
- NEC Corporation
- Kenichi Takatori
- G01 - MEASURING TESTING
Information Patent Grant
Thermoelectric 3D cooling
- Patent number 8,030,113
- Issue date Oct 4, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermoelectric cooler for semiconductor devices with TSV
- Patent number 8,026,567
- Issue date Sep 27, 2011
- Taiwan Semiconductor Manufactuirng Co., Ltd.
- Shih-Cheng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film semiconductor device, display device including the same,...
- Patent number 8,009,162
- Issue date Aug 30, 2011
- NEC Corporation
- Kenichi Takatori
- G01 - MEASURING TESTING
Information Patent Grant
Thermoelectric module
- Patent number 7,982,278
- Issue date Jul 19, 2011
- Kyocera Corporation
- Kouji Tokunaga
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Forming a thin film electric cooler and structures formed thereby
- Patent number 7,902,617
- Issue date Mar 8, 2011
- Intel Corporation
- Rajashree Baskaran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermoelectric 3D cooling
- Patent number 7,893,529
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting diode package structure
- Patent number 7,855,396
- Issue date Dec 21, 2010
- Industrial Technology Research Institute
- Ming-Ji Dai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic package and method of cooling an interconnect featu...
- Patent number 7,851,905
- Issue date Dec 14, 2010
- Intel Corporation
- Gregory M. Chrysler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Forming a thin film thermoelectric cooler and structures formed the...
- Patent number 7,833,816
- Issue date Nov 16, 2010
- Intel Corporation
- Rajashree Baskaran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film semiconductor device, circuitry thereof, and apparatus us...
- Patent number 7,728,401
- Issue date Jun 1, 2010
- NEC Corporation
- Kenichi Takatori
- G01 - MEASURING TESTING
Information Patent Grant
Methods of forming thermoelectric devices using islands of thermoel...
- Patent number 7,679,203
- Issue date Mar 16, 2010
- Nextreme Thermal Solutions, Inc.
- Jayesh Bharathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode assembly and method of fabrication
- Patent number 7,598,535
- Issue date Oct 6, 2009
- Foxconn Technology Co., Ltd.
- Tseng-Hsiang Hu
- F21 - LIGHTING
Information Patent Grant
Cooling system
- Patent number 7,466,553
- Issue date Dec 16, 2008
- QNX Cooling Systems, Inc.
- Brian A. Hamman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
CoSb3-based thermoelectric device fabrication method
- Patent number 7,321,157
- Issue date Jan 22, 2008
- GM Global Technology Operations, Inc.
- Lidong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spontaneous emission enhanced heat transport method and structures...
- Patent number 7,282,798
- Issue date Oct 16, 2007
- Research Triangle Institute
- Rama Venkatasubramanian
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Method and apparatus for thermo-electric cooling
- Patent number 7,224,059
- Issue date May 29, 2007
- Intel Corporation
- Ryo Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling system
- Patent number 7,218,523
- Issue date May 15, 2007
- QNX Cooling Systems Inc.
- Brian A. Hamman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic heat pump device, laser component, optical pickup and el...
- Patent number 7,211,891
- Issue date May 1, 2007
- Sharp Kabushiki Kaisha
- Kenji Shimogishi
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Micro-fabricated device with thermoelectric device and method of ma...
- Patent number 7,205,675
- Issue date Apr 17, 2007
- Hewlett-Packard Development Company, L.P.
- James C. McKinnell
- G11 - INFORMATION STORAGE
Information Patent Grant
Internally disposed cooling device for electronic apparatus
- Patent number 7,190,576
- Issue date Mar 13, 2007
- Waffer Technology Corp.
- Jack Wang
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Device and a method for thermal sensing
- Patent number 7,157,801
- Issue date Jan 2, 2007
- Vivactis NV
- Katarina Verhaegen
- G01 - MEASURING TESTING
Information Patent Grant
Diamond heat spreading and cooling technique for integrated circuits
- Patent number 7,132,313
- Issue date Nov 7, 2006
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromachined device having electrically isolated components and a...
- Patent number 7,115,437
- Issue date Oct 3, 2006
- Georgia Tech Research Corporation
- Mark G. Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrode structure, semiconductor light-emitting device having the...
- Patent number 7,095,042
- Issue date Aug 22, 2006
- Samsung Electronics Co., Ltd.
- Mi-yang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric module
- Patent number 7,081,677
- Issue date Jul 25, 2006
- Yamaha Corporation
- Masayoshi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOELECTRIC CONVERSION MATERIAL
- Publication number 20120161273
- Publication date Jun 28, 2012
- Hitachi, Ltd.
- Tadashi Fujieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM SEMICONDUCTOR DEVICE
- Publication number 20110274140
- Publication date Nov 10, 2011
- NEC Corporation
- Kenichi Takatori
- G02 - OPTICS
Information Patent Application
Thermoelectric 3D Cooling
- Publication number 20110104846
- Publication date May 5, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM SEMICONDUCTOR DEVICE, DISPLAY DEVICE INCLUDING THE SAME,...
- Publication number 20100194739
- Publication date Aug 5, 2010
- NEC Corporation
- Kenichi Takatori
- G02 - OPTICS
Information Patent Application
THERMOELECTRIC 3D COOLING
- Publication number 20100176506
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermoelectric Cooler for Semiconductor Devices with TSV
- Publication number 20100155700
- Publication date Jun 24, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermoelectric Module
- Publication number 20090189239
- Publication date Jul 30, 2009
- Kyocera Corporation
- Kouji Tokunaga
- F24 - HEATING RANGES VENTILATING
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATU...
- Publication number 20090079063
- Publication date Mar 26, 2009
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a thin film electric cooler and structures formed thereby
- Publication number 20080230106
- Publication date Sep 25, 2008
- Intel Corporation
- Rajashree Baskaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20080006843
- Publication date Jan 10, 2008
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOEL...
- Publication number 20070215194
- Publication date Sep 20, 2007
- Jayesh Bharathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-FABRICATED DEVICE WITH THERMOELECTRIC DEVICE AND METHOD OF MA...
- Publication number 20070152352
- Publication date Jul 5, 2007
- James C. McKinnell
- G11 - INFORMATION STORAGE
Information Patent Application
LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION
- Publication number 20070132092
- Publication date Jun 14, 2007
- FOXCONN TECHNOLOGY CO., LTD.
- TSENG-HSIANG HU
- F21 - LIGHTING
Information Patent Application
Forming a thin film thermoelectric cooler and structures formed the...
- Publication number 20070128773
- Publication date Jun 7, 2007
- Intel Corporation
- Rajashree Baskaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling system
- Publication number 20070035928
- Publication date Feb 15, 2007
- QNX Cooling Systems Inc.
- Brian A. Hamman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electrode structure, semiconductor light-emitting device having the...
- Publication number 20060252165
- Publication date Nov 9, 2006
- Samsung Electronics Co., Ltd.
- Mi-yang Kim
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor cooling system and process for manufacturing the same
- Publication number 20060208353
- Publication date Sep 21, 2006
- DTNR LTD.
- Eliezer Adar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact system module with built-in thermoelectric cooling
- Publication number 20060128059
- Publication date Jun 15, 2006
- Micron Technology, Inc.
- Kie Y. Ahn
- G02 - OPTICS
Information Patent Application
Thin-film semiconductor device, circuitry thereof, and apparatus us...
- Publication number 20060061406
- Publication date Mar 23, 2006
- NEC Corporation
- Kenichi Takatori
- G02 - OPTICS
Information Patent Application
Semiconductor cooling system and process for manufacturing the same
- Publication number 20060033206
- Publication date Feb 16, 2006
- DTNR LTD.
- Eliezer Adar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CoSb3-based thermoelectric device fabrication method
- Publication number 20060017170
- Publication date Jan 26, 2006
- Lidong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Internally disposed cooling device for electronic apparatus
- Publication number 20050281016
- Publication date Dec 22, 2005
- Jack Wang
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Electronic heat pump device, laser component, optical pickup and el...
- Publication number 20050110099
- Publication date May 26, 2005
- Kenji Shimogishi
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Electrode structure, semiconductor light-emitting device having the...
- Publication number 20050104074
- Publication date May 19, 2005
- Samsung Electronics Co., Ltd.
- Mi-yang Kim
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method and apparatus for thermo-electric cooling
- Publication number 20050085075
- Publication date Apr 21, 2005
- Ryo Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid cooling system
- Publication number 20050052848
- Publication date Mar 10, 2005
- Brian A. Hamman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Device and a method for thermal sensing
- Publication number 20050051807
- Publication date Mar 10, 2005
- Katarina Verhaegen
- G01 - MEASURING TESTING
Information Patent Application
Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs
- Publication number 20050040388
- Publication date Feb 24, 2005
- Saeid Ghamaty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromachined device having electrically isolated components and a...
- Publication number 20050042791
- Publication date Feb 24, 2005
- Mark G. Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor package with heat spreader
- Publication number 20040188831
- Publication date Sep 30, 2004
- Siliconware Precision Industries, Ltd.
- Cheng-Hsu Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Thermoelectric

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermoelectric element, method of manufacturing the same and semico...

Structure for operating system for utilizing exhaust heat of vehicle

Electronic device including thermal sensor and peltier cooler and r...

Thermoelectric conversion material

Thin-film semiconductor device

Thermoelectric 3D cooling

Thermoelectric cooler for semiconductor devices with TSV

Thin-film semiconductor device, display device including the same,...

Thermoelectric module

Forming a thin film electric cooler and structures formed thereby

Thermoelectric 3D cooling

Light emitting diode package structure

Microelectronic package and method of cooling an interconnect featu...

Forming a thin film thermoelectric cooler and structures formed the...

Thin-film semiconductor device, circuitry thereof, and apparatus us...

Methods of forming thermoelectric devices using islands of thermoel...

Light-emitting diode assembly and method of fabrication

Cooling system

CoSb3-based thermoelectric device fabrication method

Spontaneous emission enhanced heat transport method and structures...

Method and apparatus for thermo-electric cooling

Liquid cooling system

Electronic heat pump device, laser component, optical pickup and el...

Micro-fabricated device with thermoelectric device and method of ma...

Internally disposed cooling device for electronic apparatus

Device and a method for thermal sensing

Diamond heat spreading and cooling technique for integrated circuits

Micromachined device having electrically isolated components and a...

Electrode structure, semiconductor light-emitting device having the...

Thermoelectric module

Patents Applicationslast 30 patents

THERMOELECTRIC CONVERSION MATERIAL

THIN-FILM SEMICONDUCTOR DEVICE

Thermoelectric 3D Cooling

THIN-FILM SEMICONDUCTOR DEVICE, DISPLAY DEVICE INCLUDING THE SAME,...

THERMOELECTRIC 3D COOLING

Thermoelectric Cooler for Semiconductor Devices with TSV

Thermoelectric Module

MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATU...

Forming a thin film electric cooler and structures formed thereby

LIGHT EMITTING DIODE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOEL...

MICRO-FABRICATED DEVICE WITH THERMOELECTRIC DEVICE AND METHOD OF MA...

LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION

Forming a thin film thermoelectric cooler and structures formed the...

Cooling system

Electrode structure, semiconductor light-emitting device having the...

Semiconductor cooling system and process for manufacturing the same

Compact system module with built-in thermoelectric cooling

Thin-film semiconductor device, circuitry thereof, and apparatus us...

Semiconductor cooling system and process for manufacturing the same

CoSb3-based thermoelectric device fabrication method

Internally disposed cooling device for electronic apparatus

Electronic heat pump device, laser component, optical pickup and el...

Electrode structure, semiconductor light-emitting device having the...

Method and apparatus for thermo-electric cooling

Liquid cooling system

Device and a method for thermal sensing

Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs

Micromachined device having electrically isolated components and a...

Semiconductor package with heat spreader