Thermosonic bonding

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CPC
H01L2224/85207

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85207Thermosonic bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,495,570
- Issue date Nov 8, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including processor chip and memory chip
- Patent number 11,309,300
- Issue date Apr 19, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,276,666
- Issue date Mar 15, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a wire bond mesh
- Patent number 11,121,049
- Issue date Sep 14, 2021
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 10,943,855
- Issue date Mar 9, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 10,804,238
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper detection for a chip package
- Patent number 10,651,135
- Issue date May 12, 2020
- Marvell Asia Pte, Ltd.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding tools, and methods of designing ribbon bonding tools
- Patent number 10,562,127
- Issue date Feb 18, 2020
- Kulicke and Soffa Industries, Inc.
- Bernard Poncelet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,537,018
- Issue date Jan 14, 2020
- LONGITUDE LICENSING LIMITED
- Sensho Usami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 10,361,168
- Issue date Jul 23, 2019
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,342,118
- Issue date Jul 2, 2019
- LONGITUDE LICENSING LIMITED
- Sensho Usami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
- Publication number 20220216193
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER, PROTECTIVE SHEET, AND PROTECTIVE SHEET...
- Publication number 20220037160
- Publication date Feb 3, 2022
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20210193561
- Publication date Jun 24, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUPD WIRE BOND CAPILLARY DESIGN
- Publication number 20210111146
- Publication date Apr 15, 2021
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200350268
- Publication date Nov 5, 2020
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...
- Publication number 20190295983
- Publication date Sep 26, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING FILM AND TAPE FOR WAFER PROCESSING
- Publication number 20190273062
- Publication date Sep 5, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Hidemichi FUJIWARA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190254160
- Publication date Aug 15, 2019
- Longitude Licensing Limited
- Sensho Usami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH
- Publication number 20190172766
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180240771
- Publication date Aug 23, 2018
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PA...
- Publication number 20180047589
- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die
- Publication number 20180047685
- Publication date Feb 15, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180040521
- Publication date Feb 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170345787
- Publication date Nov 30, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Floating Die Package
- Publication number 20170330841
- Publication date Nov 16, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20170040286
- Publication date Feb 9, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170025318
- Publication date Jan 26, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20170005048
- Publication date Jan 5, 2017
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH HARMONIC TERMINATION CIRCUIT AND RELA...
- Publication number 20160380594
- Publication date Dec 29, 2016
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS

Thermosonic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Impedance controlled electrical interconnection employing meta-mate...

Systems and methods for optimizing looping parameters and looping t...

Impedance controlled electrical interconnection employing meta-mate...

Power amplifier systems with control interface and bias circuit

Semiconductor device having an electrical connection between semico...

Wire bonding method and wire bonding device

Semiconductor package including processor chip and memory chip

Systems and methods for optimizing looping parameters and looping t...

Semiconductor device and method of manufacturing the same

Semiconductor package with a wire bond mesh

Electronic device packaging with galvanic isolation

Wire bonding apparatus

Floating die package

Semiconductor integrated circuit device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device having an electrical connection between semico...

Power amplifier modules including transistor with grading and semic...

Electronic unit

Bonding wire having a silver alloy core, wire bonding method using...

Tamper detection for a chip package

Ribbon bonding tools, and methods of designing ribbon bonding tools

Semiconductor device

Impedance controlled electrical interconnection employing meta-mate...

Bonding wire for semiconductor device

Systems and methods for optimizing looping parameters and looping t...

Semiconductor device

Surface finish for wirebonding

Discrete flexible interconnects for modules of integrated circuits

Die attachment for packaged semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP

PROCESSING METHOD OF WAFER, PROTECTIVE SHEET, AND PROTECTIVE SHEET...

WIRE BONDING METHOD AND WIRE BONDING DEVICE

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

CUPD WIRE BOND CAPILLARY DESIGN

FLOATING DIE PACKAGE

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

Arrangements and Method for Providing a Bond Connection

SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...

JOINING FILM AND TAPE FOR WAFER PROCESSING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PA...

Remapped Packaged Extracted Die

SEMICONDUCTOR DEVICE

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

Floating Die Package

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

POWER AMPLIFIER MODULES WITH HARMONIC TERMINATION CIRCUIT AND RELA...