Thermosonic bonding

Follow

Industry

CPC
H01L2224/84207

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84207Thermosonic bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die attach material for TBGA or flexible circuitry
- Patent number 7,019,410
- Issue date Mar 28, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEX BONDED INTEGRATED CIRCUITS
- Publication number 20230299035
- Publication date Sep 21, 2023
- META PLATFORMS, INC.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die attach material for TBGA or flexible circuitry
- Publication number 20060197233
- Publication date Sep 7, 2006
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die attach material for TBGA or flexible circuitry
- Publication number 20060103032
- Publication date May 18, 2006
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS