Thermosonic bonding

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CPC
H01L2224/83207

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83207Thermosonic bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device, method of manufacturing a multi-chip device, and...
- Patent number 11,488,921
- Issue date Nov 1, 2022
- Infineon Technologies AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,121,116
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for permanent bonding
- Patent number 9,947,638
- Issue date Apr 17, 2018
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die substrate assembly and method
- Patent number 9,324,674
- Issue date Apr 26, 2016
- Ampleon Netherlands B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ultrasonic bonding having at least one first and second...
- Patent number 9,296,065
- Issue date Mar 29, 2016
- Hesse GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a high-temperature and temperature-change resi...
- Patent number 9,287,232
- Issue date Mar 15, 2016
- Danfoss Silicon Power GmbH
- Mathias Kock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting a chip
- Patent number 9,224,086
- Issue date Dec 29, 2015
- Smartrac IP B.V.
- Manfred Rietzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating an electronic component
- Patent number 9,171,804
- Issue date Oct 27, 2015
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device package
- Patent number 8,266,796
- Issue date Sep 18, 2012
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-bonding method of LED chip and LED manufactured by the same
- Patent number 8,236,687
- Issue date Aug 7, 2012
- Industrial Technology Research Institute
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding
- Patent number 7,789,287
- Issue date Sep 7, 2010
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on back metal for semiconductor die
- Patent number 6,376,910
- Issue date Apr 23, 2002
- International Rectifier Corporation
- Jorge Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-backed wafer and chip
- Patent number 4,866,505
- Issue date Sep 12, 1989
- Analog Devices, Inc.
- Carl M. Roberts
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...
- Publication number 20210098410
- Publication date Apr 1, 2021
- INFINEON TECHNOLOGIES AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...
- Publication number 20200235072
- Publication date Jul 23, 2020
- Mitsubishi Electric Corporation
- Keisuke KAWAMOTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOL...
- Publication number 20180082975
- Publication date Mar 22, 2018
- RSM ELECTRON POWER, INC.
- Robert Conte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR PERMANENT BONDING
- Publication number 20170053892
- Publication date Feb 23, 2017
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...
- Publication number 20140151439
- Publication date Jun 5, 2014
- Hesse GmbH
- Hans-Juergen Hesse
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Method for Fabricating an Electronic Component
- Publication number 20140138843
- Publication date May 22, 2014
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND...
- Publication number 20130334561
- Publication date Dec 19, 2013
- Hsiu-Jen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING METHOD
- Publication number 20120329182
- Publication date Dec 27, 2012
- Teppei Kojio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
- Publication number 20120321907
- Publication date Dec 20, 2012
- SENSONOR TECHNOLOGIES AS
- Nils Hoivik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE-BONDED LED
- Publication number 20120256228
- Publication date Oct 11, 2012
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING A CHIP
- Publication number 20120234579
- Publication date Sep 20, 2012
- Manfred Rietzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING A HIGH-TEMPERATURE AND TEMPERATURE-CHANGE RESI...
- Publication number 20120037688
- Publication date Feb 16, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-BONDING METHOD OF LED CHIP AND LED MANUFACTURED BY THE SAME
- Publication number 20110127563
- Publication date Jun 2, 2011
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE, AND METHOD OF MANUFACTURING MOUNTING STRUCTURE
- Publication number 20110114706
- Publication date May 19, 2011
- PANASONIC CORPORATION
- Tatsuo Sasaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING
- Publication number 20090230172
- Publication date Sep 17, 2009
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, semiconductor device package including the wiring...
- Publication number 20080291655
- Publication date Nov 27, 2008
- Samsung Electronics Co. Ltd.
- Ji-Yong Park
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Thermosonic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of power semiconductor device, power semicondu...

Multi-chip device, method of manufacturing a multi-chip device, and...

Manufacturing method of power semiconductor device, power semicondu...

Method for producing a connecting medium on an assembly partner, me...

Electronic device and method for producing an electronic device

Device and method for permanent bonding

Method for producing a material-bonding connection between a semico...

Mounting method

Die substrate assembly and method

Method for ultrasonic bonding having at least one first and second...

Method for producing a high-temperature and temperature-change resi...

Method for contacting a chip

Method for fabricating an electronic component

Semiconductor device and production method therefor

Semiconductor device and production method therefor

Method of fabricating a semiconductor device package

Die-bonding method of LED chip and LED manufactured by the same

Method of bonding

Solder-on back metal for semiconductor die

Aluminum-backed wafer and chip

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD USING THE SAME

Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...

MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...

METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOL...

DEVICE AND METHOD FOR PERMANENT BONDING

METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...

Method for Fabricating an Electronic Component

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND...

SEMICONDUCTOR DEVICE MOUNTING METHOD

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

DIE-BONDED LED

METHOD FOR CONTACTING A CHIP

METHOD FOR PRODUCING A HIGH-TEMPERATURE AND TEMPERATURE-CHANGE RESI...

DIE-BONDING METHOD OF LED CHIP AND LED MANUFACTURED BY THE SAME

MOUNTING STRUCTURE, AND METHOD OF MANUFACTURING MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

METHOD OF BONDING

Wiring substrate, semiconductor device package including the wiring...