TREA

Thickness uniformity of coated layers or desired profile of target erosion

Follow

Industry

  • CPC
  • H01J37/347
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/347Thickness uniformity of coated layers or desired profile of target erosion
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE
    • Publication number 20250014878
    • Publication date Jan 9, 2025
    • Applied Materials, Inc.
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING
    • Publication number 20240429036
    • Publication date Dec 26, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Hsi Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEPOSITION SYSTEM AND METHOD
    • Publication number 20240387156
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wen-Hao CHENG
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Method for Improving Deposition Process
    • Publication number 20240387155
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jung-Tang Wu
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PHYSICAL VAPOR DEPOSITION APPARATUS
    • Publication number 20240360545
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuo-Lung Huo
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PLASMA BASED FILM MODIFICATION FOR SEMICONDUCTOR DEVICES
    • Publication number 20240352575
    • Publication date Oct 24, 2024
    • Applied Materials, Inc.
    • Timothy J. Miller
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
    • Publication number 20240347327
    • Publication date Oct 17, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yen-Liang LIN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER...
    • Publication number 20240304430
    • Publication date Sep 12, 2024
    • Applied Materials, Inc.
    • Mehdi Vaez-Iravani
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PLASMA PROCESS SIMULATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTU...
    • Publication number 20240274416
    • Publication date Aug 15, 2024
    • Samsung Electronics Co., Ltd.
    • Jaesik An
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SPUTTERING APPARATUS
    • Publication number 20240258088
    • Publication date Aug 1, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • HYUN-WOO KIM
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Plasma Etching with Metal Sputtering
    • Publication number 20240249927
    • Publication date Jul 25, 2024
    • TOKYO ELECTRON LIMITED
    • Minjoon Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEPOSITION OF NON-STOICHIOMETRIC METAL COMPOUND LAYER
    • Publication number 20240229228
    • Publication date Jul 11, 2024
    • SOLERAS ADVANCED COATINGS BV
    • Wilmert DE BOSSCHER
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Power Compensation in PVD Chambers
    • Publication number 20240213007
    • Publication date Jun 27, 2024
    • Junjie PAN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    BIAS MAGNETIC FIELD CONTROL METHOD, CONTROL DEVICE, AND SEMICONDUCT...
    • Publication number 20240191340
    • Publication date Jun 13, 2024
    • Beijing NAURA Microelectronics Equipment Co., Ltd.
    • Yujie GENG
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SYSTEM AND METHODS FOR DEPOSITING MATERIAL ON A SUBSTRATE
    • Publication number 20240170269
    • Publication date May 23, 2024
    • Applied Materials, Inc.
    • Harish PENMETHSA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    DEPOSITION OF NON-STOICHIOMETRIC METAL COMPOUND LAYER
    • Publication number 20240133025
    • Publication date Apr 25, 2024
    • SOLERAS ADVANCED COATINGS BV
    • Wilmert DE BOSSCHER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN FILM FORMING APPARATUS AND METHOD
    • Publication number 20240112897
    • Publication date Apr 4, 2024
    • SEMES CO., LTD.
    • Sun Il KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
    • Publication number 20240096609
    • Publication date Mar 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yen-Liang LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SPUTTERING APPARATUS
    • Publication number 20240063003
    • Publication date Feb 22, 2024
    • Canon ANELVA Corporation
    • Susumu KARINO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EROSION RATE MONITORING FOR WAFER FABRICATION EQUIPMENT
    • Publication number 20240030006
    • Publication date Jan 25, 2024
    • Micron Technology, Inc.
    • Synn Nee Chow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Apparatus and a Method of Controlling Thickness Variation in a Mate...
    • Publication number 20240014018
    • Publication date Jan 11, 2024
    • SPTS TECHNOLOGIES LIMITED
    • Tony WILBY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
    • Publication number 20230386807
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yen-Liang CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEPOSITION SYSTEM AND METHOD
    • Publication number 20230386942
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wen-Hao CHENG
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS
    • Publication number 20230386808
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yen-Liang CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR TOOL FOR COPPER DEPOSITION
    • Publication number 20230386809
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Hung TSAI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    FABRICATION OF ELECTROCHROMIC DEVICES
    • Publication number 20230324754
    • Publication date Oct 12, 2023
    • VIEW, INC.
    • Robert Tad Rozbicki
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    FABRICATION OF ELECTROCHROMIC DEVICES
    • Publication number 20230314892
    • Publication date Oct 5, 2023
    • VIEW, INC.
    • Robert Tad Rozbicki
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SEMICONDUCTOR TOOL FOR COPPER DEPOSITION
    • Publication number 20230260770
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chia-Hung TSAI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ELECTROCHROMIC DEVICES
    • Publication number 20230144179
    • Publication date May 11, 2023
    • VIEW, INC.
    • Zhongchun Wang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    OVERHANG REDUCTION USING PULSED BIAS
    • Publication number 20230113961
    • Publication date Apr 13, 2023
    • Applied Materials, Inc.
    • Bencherki Mebarki
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...