Thinned leads

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CPC
H05K2201/10848

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10848Thinned leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic module produced by sequential fixation of the components
- Patent number 9,706,694
- Issue date Jul 11, 2017
- Valeo Systemes de Controle Moteur
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder spacer and electronic module comprising such a spacer
- Patent number 9,629,245
- Issue date Apr 18, 2017
- Sagemcom Broadband SAS
- Stephane Kohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,332,645
- Issue date May 3, 2016
- Denso Corporation
- Yuuto Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for converting commerical off-the-shelf (COTS)...
- Patent number 9,318,350
- Issue date Apr 19, 2016
- General Dynamics Advanced Information Systems, Inc.
- Deepak Keshav Pai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electronic module by means of sequential fi...
- Patent number 8,468,691
- Issue date Jun 25, 2013
- Valeo Systemes de Controle Moteur
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounted chip resistor with flexible leads
- Patent number 8,325,005
- Issue date Dec 4, 2012
- Vishay International, Ltd.
- Joseph Szwarc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having grooved leads to confine solder wicking
- Patent number 8,129,227
- Issue date Mar 6, 2012
- Texas Instruments Incorporated
- John P Tellkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board terminal and printed circuit board connector...
- Patent number 8,070,535
- Issue date Dec 6, 2011
- Sumitomo Wiring Systems, Ltd.
- Hideki Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounted chip resistor with flexible leads
- Patent number 7,965,169
- Issue date Jun 21, 2011
- Joseph Szwarc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with varying rigidity leads using Pb-free solder
- Patent number 7,911,062
- Issue date Mar 22, 2011
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket with solder pad
- Patent number 7,841,859
- Issue date Nov 30, 2010
- Hon Hai Precision Ind. Co., Ltd.
- Fang-Chu Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having grooved leads to confine solder wicking
- Patent number 7,821,111
- Issue date Oct 26, 2010
- Texas Instruments Incorporated
- John Tellkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mountable semiconductor package with solder bonding features
- Patent number 7,737,546
- Issue date Jun 15, 2010
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Wai Hoong Moy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having semiconductor element with back electro...
- Patent number 7,709,947
- Issue date May 4, 2010
- Kabushiki Kaisha Toyota Jidoshokki
- Jun Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including printed circuit board and electronic el...
- Patent number 7,578,681
- Issue date Aug 25, 2009
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shunt connection to a PCB of an energy management system employed i...
- Patent number 7,319,304
- Issue date Jan 15, 2008
- Midtronics, Inc.
- Balaguru K. Veloo
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Angular velocity senor
- Patent number 7,234,352
- Issue date Jun 26, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tomohiro Mitani
- G01 - MEASURING TESTING
Information Patent Grant
Vibrator support structure and manufacturing method for the support...
- Patent number 7,161,282
- Issue date Jan 9, 2007
- Murata Manufacturing Co., Ltd.
- Masato Koike
- G01 - MEASURING TESTING
Information Patent Grant
Electronic control unit
- Patent number 7,158,372
- Issue date Jan 2, 2007
- Advics Co., Ltd.
- Satoshi Sanada
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Structure for mounting connector on board
- Patent number 6,840,781
- Issue date Jan 11, 2005
- Kabushiki Kaisha Tokai Rika Denki Seisakusho
- Harehide Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head gimbal assembly interconnecting leads having improved robustne...
- Patent number 6,728,068
- Issue date Apr 27, 2004
- Seagate Technology LLC
- Adam K. Himes
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for providing electromagnetic shielding
- Patent number 6,490,173
- Issue date Dec 3, 2002
- Thomson Licensing, S.A.
- Russell Wayne Perkins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slotted lead for a semiconductor device
- Patent number 6,040,623
- Issue date Mar 21, 2000
- Texas Instruments Incorporated
- Min Yu Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slotted printed circuit board surface mount stress relief system
- Patent number 6,011,693
- Issue date Jan 4, 2000
- Sawtek Inc.
- John G. Gore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating microbump interconnect for bare semiconducto...
- Patent number 5,834,366
- Issue date Nov 10, 1998
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbump interconnect for bore semiconductor dice
- Patent number 5,808,360
- Issue date Sep 15, 1998
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal for electronic component and method of manufacturing the same
- Patent number 5,792,985
- Issue date Aug 11, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hisashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting stress relief device and method
- Patent number 5,690,270
- Issue date Nov 25, 1997
- Sawtek Inc.
- John G. Gore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attachment of a semiconductor slotted lead to a substrate
- Patent number 5,647,124
- Issue date Jul 15, 1997
- Texas Instruments Incorporated
- Min Yu Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount stress relief hidden lead package device and method
- Patent number 5,573,172
- Issue date Nov 12, 1996
- Sawtek, Inc.
- John G. Gore
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140240885
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Yuuto KAMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Converting Commerical Off-The-Shelf (COTS)...
- Publication number 20140131307
- Publication date May 15, 2014
- Deepak Keshav Pai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FI...
- Publication number 20130301231
- Publication date Nov 14, 2013
- VALEO SYSTEMES DE CONTROLE MOTEUR
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF...
- Publication number 20130148320
- Publication date Jun 13, 2013
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS
- Publication number 20110241819
- Publication date Oct 6, 2011
- VISHAY INTERNATIONAL, LTD.
- Joseph Szwarc
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD TERMINAL AND PRINTED CIRCUIT BOARD CONNECTOR...
- Publication number 20110111609
- Publication date May 12, 2011
- Sumitomo Wiring Systems, Ltd.
- Hideki GOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD TERMINAL
- Publication number 20110051389
- Publication date Mar 3, 2011
- Sumitomo Wiring Systems, Ltd.
- Hideki GOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Having Grooved Leads to Confine Solder Wicking
- Publication number 20110008936
- Publication date Jan 13, 2011
- TEXAS INSTRUMENTS INCORPORATED
- John Tellkamp
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FI...
- Publication number 20090217519
- Publication date Sep 3, 2009
- VALEO SYSTEMES DE CONTROLE MOTEUR
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS
- Publication number 20090212900
- Publication date Aug 27, 2009
- VISHAY INTERTECHNOLOGY, LTD.
- JOSEPH SZWARC
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF...
- Publication number 20090166339
- Publication date Jul 2, 2009
- VALEO SYSTEMES DE CONTROLE MOTEUR
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Having Grooved Leads to Confine Solder Wicking
- Publication number 20090091007
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- John Tellkamp
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic device including printed circuit board and electronic el...
- Publication number 20090068864
- Publication date Mar 12, 2009
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Mountable Semiconductor Package with Solder Bonding Features
- Publication number 20090057850
- Publication date Mar 5, 2009
- Wai Hoong Moy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Socket with solder pad
- Publication number 20090047805
- Publication date Feb 19, 2009
- HON HAI PRECISION IND. CO., LTD.
- Fang-Chu Liao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and System of Heat Conductor
- Publication number 20080190653
- Publication date Aug 14, 2008
- Ola Tageman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070290342
- Publication date Dec 20, 2007
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Jun Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT WITH LEAD USING PB-FREE SOLDER
- Publication number 20070210139
- Publication date Sep 13, 2007
- Tetsuya NAKATSUKA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Vibrator support structure and manufacturing method for the support...
- Publication number 20060137815
- Publication date Jun 29, 2006
- Masato Koike
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Angular velocity sensor
- Publication number 20060089019
- Publication date Apr 27, 2006
- Tomohiro Mitani
- G01 - MEASURING TESTING
Information Patent Application
Shunt connection to a PCB of an energy management system employed i...
- Publication number 20050057865
- Publication date Mar 17, 2005
- Midtronics, Inc.
- Balaguru K. Veloo
- B60 - VEHICLES IN GENERAL
Information Patent Application
Electronic control unit
- Publication number 20050018390
- Publication date Jan 27, 2005
- Satoshi Sanada
- B60 - VEHICLES IN GENERAL
Information Patent Application
Vibrator support structure and manufacturing method for the support...
- Publication number 20040155560
- Publication date Aug 12, 2004
- Murata Manufacturing Co., Ltd.
- Masato Koike
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure for mounting connector on board
- Publication number 20040072455
- Publication date Apr 15, 2004
- Harehide Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for providing electromagnetic shielding
- Publication number 20020075664
- Publication date Jun 20, 2002
- Russell Wayne Perkins
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Thinned leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module produced by sequential fixation of the components

Solder spacer and electronic module comprising such a spacer

Electronic part and electronic control unit

Method and apparatus for converting commerical off-the-shelf (COTS)...

Method for producing an electronic module by means of sequential fi...

Surface mounted chip resistor with flexible leads

Semiconductor device having grooved leads to confine solder wicking

Printed circuit board terminal and printed circuit board connector...

Surface mounted chip resistor with flexible leads

Electronic component with varying rigidity leads using Pb-free solder

Socket with solder pad

Semiconductor device having grooved leads to confine solder wicking

Surface mountable semiconductor package with solder bonding features

Semiconductor device having semiconductor element with back electro...

Electronic device including printed circuit board and electronic el...

Shunt connection to a PCB of an energy management system employed i...

Angular velocity senor

Vibrator support structure and manufacturing method for the support...

Electronic control unit

Structure for mounting connector on board

Head gimbal assembly interconnecting leads having improved robustne...

Method and apparatus for providing electromagnetic shielding

Slotted lead for a semiconductor device

Slotted printed circuit board surface mount stress relief system

Method for fabricating microbump interconnect for bare semiconducto...

Microbump interconnect for bore semiconductor dice

Terminal for electronic component and method of manufacturing the same

Surface mounting stress relief device and method

Method of attachment of a semiconductor slotted lead to a substrate

Surface mount stress relief hidden lead package device and method

Patents Applicationslast 30 patents

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

Method and Apparatus for Converting Commerical Off-The-Shelf (COTS)...

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FI...

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF...

SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS

PRINTED CIRCUIT BOARD TERMINAL AND PRINTED CIRCUIT BOARD CONNECTOR...

BOARD TERMINAL

Semiconductor Device Having Grooved Leads to Confine Solder Wicking

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FI...

SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF...

Semiconductor Device Having Grooved Leads to Confine Solder Wicking

Electronic device including printed circuit board and electronic el...

Surface Mountable Semiconductor Package with Solder Bonding Features

Socket with solder pad

Method and System of Heat Conductor

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT WITH LEAD USING PB-FREE SOLDER

Vibrator support structure and manufacturing method for the support...

Angular velocity sensor

Shunt connection to a PCB of an energy management system employed i...

Electronic control unit

Vibrator support structure and manufacturing method for the support...

Structure for mounting connector on board

Method and apparatus for providing electromagnetic shielding