Thorium [Th]

Industry

CPC
H01L2924/0109

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0109Thorium [Th]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing cu core ball
- Patent number 10,370,771
- Issue date Aug 6, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an interposer with microspring contacts
- Patent number 9,967,982
- Issue date May 8, 2018
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic system
- Patent number 9,748,449
- Issue date Aug 29, 2017
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of refining solder materials
- Patent number 9,666,547
- Issue date May 30, 2017
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic devices including two or more substrates electrically co...
- Patent number 9,345,135
- Issue date May 17, 2016
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Core ball, solder paste, formed-solder, flux-coated core ball and s...
- Patent number 9,278,409
- Issue date Mar 8, 2016
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...
- Patent number 9,266,196
- Issue date Feb 23, 2016
- Senju Metal Industry Co., Ltd.
- Takashi Akagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising a nanotube-based interface connection...
- Patent number 9,145,294
- Issue date Sep 29, 2015
- STMicroelectronics S.R.L.
- Davide Giuseppe Patti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 9,117,550
- Issue date Aug 25, 2015
- Bao Q. Tran
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Chip on wafer bonder
- Patent number 9,093,447
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 9,087,754
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant under-bump metallization of nickel-iron...
- Patent number 9,082,762
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,082,627
- Issue date Jul 14, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Optoelectronic system
- Patent number 8,999,736
- Issue date Apr 7, 2015
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 8,916,464
- Issue date Dec 23, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure and method for forming bump
- Patent number 8,887,383
- Issue date Nov 18, 2014
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked electronic device and method of making such an electronic d...
- Patent number 8,860,200
- Issue date Oct 14, 2014
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Systems and methods for enabling ESD protection on 3-D stacked devices
- Patent number 8,847,360
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including two or more substrates electrically co...
- Patent number 8,837,212
- Issue date Sep 16, 2014
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 8,802,506
- Issue date Aug 12, 2014
- Dow Corning Toray Company, Ltd.
- Minoru Isshiki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fan-out chip scale package
- Patent number 8,679,963
- Issue date Mar 25, 2014
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices formed of two or more substrates connected toget...
- Patent number 8,570,798
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microsprings partially embedded in a laminate structure and methods...
- Patent number 8,519,534
- Issue date Aug 27, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out chip scale package
- Patent number 8,482,136
- Issue date Jul 9, 2013
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on wafer bonder
- Patent number 8,387,674
- Issue date Mar 5, 2013
- Taiwan Semiconductor Manufacturing Comany, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20170324009
- Publication date Nov 9, 2017
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...
- Publication number 20150217409
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Takashi AKAGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...
- Publication number 20150217408
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
- Publication number 20150209912
- Publication date Jul 30, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...
- Publication number 20140340861
- Publication date Nov 20, 2014
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...
- Publication number 20140029225
- Publication date Jan 30, 2014
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20130273731
- Publication date Oct 17, 2013
- Jan GULPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing an Interposer with Microspring Contacts
- Publication number 20130232782
- Publication date Sep 12, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- G01 - MEASURING TESTING
Information Patent Application
CHIP ON WAFER BONDER
- Publication number 20130157412
- Publication date Jun 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Method For Low Temperature Bonding And Bonded Structure
- Publication number 20120097638
- Publication date Apr 26, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microsprings Partially Embedded In A Laminate Structure And Methods...
- Publication number 20120068331
- Publication date Mar 22, 2012
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- G01 - MEASURING TESTING
Information Patent Application
Systems and Methods for Enabling Esd Protection on 3-D Stacked Devices
- Publication number 20120061804
- Publication date Mar 15, 2012
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING A NANOTUBE-BASED INTERFACE CONNECTION...
- Publication number 20110316173
- Publication date Dec 29, 2011
- STMicroelectronics S.r.l.
- Davide Giuseppe PATTI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...
- Publication number 20110300487
- Publication date Dec 8, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES FORMED OF TWO OR MORE SUBSTRATES CONNECTED TOGET...
- Publication number 20110233774
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Roy E. Meade
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20110229642
- Publication date Sep 22, 2011
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING A COMPONENT
- Publication number 20110203731
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Hidekazu ARASE
- B32 - LAYERED PRODUCTS
Information Patent Application
Dice Rearrangement Package Structure Using Layout Process to Form a...
- Publication number 20110163426
- Publication date Jul 7, 2011
- Geng-Shin SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT UNDER-BUMP METALLIZATION OF NICKEL-IRON...
- Publication number 20110156256
- Publication date Jun 30, 2011
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20110156237
- Publication date Jun 30, 2011
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR D...
- Publication number 20110151588
- Publication date Jun 23, 2011
- COOLEDGE LIGHTING, INC.
- Ian Ashdown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC DEVICE AND METHOD OF MAKING SUCH AN ELECTRONIC D...
- Publication number 20110114377
- Publication date May 19, 2011
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS
- Publication number 20110086468
- Publication date Apr 14, 2011
- Yacine Felk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE
- Publication number 20110067803
- Publication date Mar 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS

Thorium [Th]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cu column, Cu core column, solder joint, and through-silicon via

Method of manufacturing cu core ball

Method for low temperature bonding and bonded structure

Method of producing an interposer with microspring contacts

Optoelectronic system

Method of refining solder materials

Method for low temperature bonding and bonded structure

Electronic devices including two or more substrates electrically co...

Method for low temperature bonding and bonded structure

Core ball, solder paste, formed-solder, flux-coated core ball and s...

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...

Electronic device comprising a nanotube-based interface connection...

Nano memory, light, energy, antenna and strand-based systems and me...

Chip on wafer bonder

Structures and methods for improving solder bump connections in sem...

Electromigration-resistant under-bump metallization of nickel-iron...

Method for low temperature bonding and bonded structure

Optoelectronic system

Structures and methods for improving solder bump connections in sem...

Electrode structure and method for forming bump

Stacked electronic device and method of making such an electronic d...

Systems and methods for enabling ESD protection on 3-D stacked devices

Electronic devices including two or more substrates electrically co...

Method of manufacturing a semiconductor device and a semiconductor...

Fan-out chip scale package

Electronic devices formed of two or more substrates connected toget...

Post passivation structure for a semiconductor device and packaging...

Microsprings partially embedded in a laminate structure and methods...

Fan-out chip scale package

Chip on wafer bonder

Patents Applicationslast 30 patents

OPTOELECTRONIC SYSTEM

WIRE BONDING SYSTEMS AND RELATED METHODS

OPTOELECTRONIC SYSTEM

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...

CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...

FAN-OUT CHIP SCALE PACKAGE

Method of Producing an Interposer with Microspring Contacts

CHIP ON WAFER BONDER

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Method For Low Temperature Bonding And Bonded Structure

Microsprings Partially Embedded In A Laminate Structure And Methods...

Systems and Methods for Enabling Esd Protection on 3-D Stacked Devices

ELECTRONIC DEVICE COMPRISING A NANOTUBE-BASED INTERFACE CONNECTION...

METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...

ELECTRONIC DEVICES FORMED OF TWO OR MORE SUBSTRATES CONNECTED TOGET...

METHOD FOR DISPOSING A COMPONENT

METHOD FOR MOUNTING A COMPONENT

Dice Rearrangement Package Structure Using Layout Process to Form a...

ELECTROMIGRATION-RESISTANT UNDER-BUMP METALLIZATION OF NICKEL-IRON...

FAN-OUT CHIP SCALE PACKAGE

METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR D...

STACKED ELECTRONIC DEVICE AND METHOD OF MAKING SUCH AN ELECTRONIC D...

ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS

METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE