Three-dimensional structures

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G02B6/12002

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/12002Three-dimensional structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Clock signal distribution using photonic fabric
- Patent number 12,259,575
- Issue date Mar 25, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,259,578
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Grant
Photonic quantum computer assembly with a quantum computing die fac...
- Patent number 12,242,123
- Issue date Mar 4, 2025
- PSIQUANTUM, CORP.
- Gabriel J. Mendoza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated optical component having an expanded light beam
- Patent number 12,228,767
- Issue date Feb 18, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- G02 - OPTICS
Information Patent Grant
Photonic chip
- Patent number 12,222,544
- Issue date Feb 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Joan Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic implementation of keys update and hash generation for digi...
- Patent number 12,219,050
- Issue date Feb 4, 2025
- Milkshake Technology Inc.
- Bicky A. Marquez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure
- Patent number 12,210,187
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband back mirror for a photonic chip
- Patent number 12,210,186
- Issue date Jan 28, 2025
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of integrated analytical devices and methods for production
- Patent number 12,204,142
- Issue date Jan 21, 2025
- Pacific Biosciences of California, Inc.
- Ravi Saxena
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Vertical grating coupler
- Patent number 12,189,179
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Chun Huang
- G02 - OPTICS
Information Patent Grant
Optical coupling
- Patent number 12,189,195
- Issue date Jan 7, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit packaging architecture
- Patent number 12,181,710
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Grant
Checkerboard imager and implementation method therefor
- Patent number 12,174,417
- Issue date Dec 24, 2024
- Shanghai Institute of Technical Physics, Chinese Academy of Sciences
- Qinghua Yu
- G02 - OPTICS
Information Patent Grant
Light distribution structure and element, related method and uses
- Patent number 12,153,250
- Issue date Nov 26, 2024
- Nitto Denko Corporation
- Kari Rinko
- G02 - OPTICS
Information Patent Grant
Hybrid manufacturing for integrating photonic and electronic compon...
- Patent number 12,147,083
- Issue date Nov 19, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line edge couplers with a tapered grating
- Patent number 12,147,075
- Issue date Nov 19, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Grant
Photonic silicon spatial beam transformer integrated on 3DIC packag...
- Patent number 12,124,078
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- G02 - OPTICS
Information Patent Grant
Waveguide platform
- Patent number 12,117,647
- Issue date Oct 15, 2024
- Rockley Photonics Limited
- Adam Scofield
- G02 - OPTICS
Information Patent Grant
Three-dimensional micro-electro-mechanical, microfluidic, and micro...
- Patent number 12,080,651
- Issue date Sep 3, 2024
- NIELSON SCIENTIFIC, LLC
- Gregory Nolan Nielson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated polarization rotation and splitting using mode hybridiza...
- Patent number 12,072,531
- Issue date Aug 27, 2024
- Analog Photonics LLC
- Zhan Su
- G02 - OPTICS
Information Patent Grant
Protective ring structure to increase waveguide performance
- Patent number 12,066,659
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer integrated photonic structure
- Patent number 12,044,882
- Issue date Jul 23, 2024
- Imec VZW
- Bruno Figeys
- G02 - OPTICS
Information Patent Grant
Package structure including photonic package and interposer having...
- Patent number 12,044,892
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Multilayer optical devices and systems
- Patent number 12,025,744
- Issue date Jul 2, 2024
- Waymo LLC
- James Dunphy
- G02 - OPTICS
Information Patent Grant
Fiber-to-fiber platform for multi-layer ferroelectric on insulator...
- Patent number 12,019,271
- Issue date Jun 25, 2024
- OHIO STATE INNOVATION FOUNDATION
- Ronald Reano
- G02 - OPTICS
Information Patent Grant
Multi-layer waveguide optical coupler
- Patent number 11,971,573
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Chun Huang
- G02 - OPTICS
Information Patent Grant
Devices, systems, and methods for optical signal processing
- Patent number 11,960,122
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Multilayer photonic devices with metastructured layers
- Patent number 11,962,351
- Issue date Apr 16, 2024
- X Development LLC
- Ian Alexander Durant Williamson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical power splitter and method of manufacturing the same
- Patent number 11,953,719
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Chun Huang
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION
- Publication number 20250096142
- Publication date Mar 20, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jae Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC ELEMENT AND NETWORK OF PHOTONIC ELEMENTS
- Publication number 20250093580
- Publication date Mar 20, 2025
- VIAVI SOLUTIONS INC.
- William D. HOUCK
- G02 - OPTICS
Information Patent Application
PHOTONIC ELEMENT AND NETWORK OF PHOTONIC ELEMENTS
- Publication number 20250093576
- Publication date Mar 20, 2025
- VIAVI SOLUTIONS INC.
- William D. HOUCK
- G02 - OPTICS
Information Patent Application
VERTICAL GRATING COUPLER
- Publication number 20250093577
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Chun Huang
- G02 - OPTICS
Information Patent Application
Quantum Well In-Line Power Montior
- Publication number 20250093578
- Publication date Mar 20, 2025
- Infinera Corporation
- Peter W. EVANS
- G02 - OPTICS
Information Patent Application
Optical Coupling
- Publication number 20250085492
- Publication date Mar 13, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
HYPERSPECTRAL COMPRESSIVE IMAGING WITH INTEGRATED PHOTONICS
- Publication number 20250076573
- Publication date Mar 6, 2025
- The Regents of the University of California
- Sung-Joo Ben Yoo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
- Publication number 20250060531
- Publication date Feb 20, 2025
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
Optical Coupling Structure
- Publication number 20250052950
- Publication date Feb 13, 2025
- LiGenTec SA
- Davide Sacchetto
- G02 - OPTICS
Information Patent Application
SPOT-SIZE CONVERTER STRUCTURE AND PHOTONIC DEVICE
- Publication number 20250044509
- Publication date Feb 6, 2025
- SUZHOU LYCORE TECHNOLOGIES CO., LTD.
- Hanxiao LIANG
- G02 - OPTICS
Information Patent Application
Integrated Edge Coupler
- Publication number 20250028113
- Publication date Jan 23, 2025
- LiGenTec SA
- Thomas HESSLER
- G02 - OPTICS
Information Patent Application
SILICON PHOTONICS STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250028116
- Publication date Jan 23, 2025
- United Microelectronics Corp.
- Meng Ting Chiang
- G02 - OPTICS
Information Patent Application
Photonic integrated circuits
- Publication number 20250020863
- Publication date Jan 16, 2025
- Teknologian Tutkimuskeskus VTT Oy
- Matteo Cherchi
- G02 - OPTICS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATING PHOTONIC AND ELECTRONIC COMPON...
- Publication number 20250020873
- Publication date Jan 16, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC-ELECTRONIC INTEGRATED-CIRCUIT CHIP AND PROCESS FOR FABRICA...
- Publication number 20250004196
- Publication date Jan 2, 2025
- SOITEC
- Ionut Radu
- G02 - OPTICS
Information Patent Application
PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...
- Publication number 20240418932
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu HUANG
- G02 - OPTICS
Information Patent Application
OPTICAL PACKAGING
- Publication number 20240411084
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC TRANSMISSION STRUCTURE
- Publication number 20240402420
- Publication date Dec 5, 2024
- VIAVI SOLUTIONS INC.
- William D. HOUCK
- G02 - OPTICS
Information Patent Application
INTEGRATED 3DIC WITH STACKED PHOTONIC DIES AND METHOD FORMING SAME
- Publication number 20240385367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240385377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICONDUCTOR-ON-INSULATO...
- Publication number 20240371943
- Publication date Nov 7, 2024
- ATOMERA INCORPORATED
- DONGHUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL RECEIVER
- Publication number 20240361519
- Publication date Oct 31, 2024
- Mitsubishi Electric Corporation
- Mizuki SHIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMMUNICATION SUBSTRATE USING GLASS INTERPOSER
- Publication number 20240353614
- Publication date Oct 24, 2024
- Lightmatter, Inc
- Darius Bunandar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Dicing Lines for Photonics Circuits
- Publication number 20240345314
- Publication date Oct 17, 2024
- LiGenTec SA
- Davide Sacchetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20240345315
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Yen TING
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...
- Publication number 20240337800
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BYPASS WAVGUIDE CONFIGURED TO FACILITATE INTER-LEVEL OPTICAL COUPLI...
- Publication number 20240329297
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chan-Hong Chern
- G02 - OPTICS
Information Patent Application
MULTI-TIERED SEMICONDUCTOR WAVEGUIDE AND MULTI-TIERED WAVEGUIDE HEATER
- Publication number 20240329298
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Liu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
- Publication number 20240319437
- Publication date Sep 26, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
CO-PACKAGED OPTICS ASSEMBLIES
- Publication number 20240310578
- Publication date Sep 19, 2024
- Corning Research & Development Corporation
- Lars Martin Otfried Brusberg
- H01 - BASIC ELECTRIC ELEMENTS

Three-dimensional structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Clock signal distribution using photonic fabric

Photonic semiconductor device and method of manufacture

Photonic quantum computer assembly with a quantum computing die fac...

Integrated optical component having an expanded light beam

Photonic chip

Package and method of forming same

Photonic implementation of keys update and hash generation for digi...

Semiconductor structure

Broadband back mirror for a photonic chip

Arrays of integrated analytical devices and methods for production

Vertical grating coupler

Optical coupling

Photonic integrated circuit packaging architecture

Checkerboard imager and implementation method therefor

Light distribution structure and element, related method and uses

Hybrid manufacturing for integrating photonic and electronic compon...

Back-end-of-line edge couplers with a tapered grating

Photonic silicon spatial beam transformer integrated on 3DIC packag...

Waveguide platform

Three-dimensional micro-electro-mechanical, microfluidic, and micro...

Integrated polarization rotation and splitting using mode hybridiza...

Protective ring structure to increase waveguide performance

Multilayer integrated photonic structure

Package structure including photonic package and interposer having...

Multilayer optical devices and systems

Fiber-to-fiber platform for multi-layer ferroelectric on insulator...

Multi-layer waveguide optical coupler

Devices, systems, and methods for optical signal processing

Multilayer photonic devices with metastructured layers

Optical power splitter and method of manufacturing the same

Patents Applicationslast 30 patents

ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION

PHOTONIC ELEMENT AND NETWORK OF PHOTONIC ELEMENTS

PHOTONIC ELEMENT AND NETWORK OF PHOTONIC ELEMENTS

VERTICAL GRATING COUPLER

Quantum Well In-Line Power Montior

Optical Coupling

HYPERSPECTRAL COMPRESSIVE IMAGING WITH INTEGRATED PHOTONICS

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE

Optical Coupling Structure

SPOT-SIZE CONVERTER STRUCTURE AND PHOTONIC DEVICE

Integrated Edge Coupler

SILICON PHOTONICS STRUCTURE AND MANUFACTURING METHOD THEREOF

Photonic integrated circuits

HYBRID MANUFACTURING FOR INTEGRATING PHOTONIC AND ELECTRONIC COMPON...

PHOTONIC-ELECTRONIC INTEGRATED-CIRCUIT CHIP AND PROCESS FOR FABRICA...

PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...

OPTICAL PACKAGING

PHOTONIC TRANSMISSION STRUCTURE

INTEGRATED 3DIC WITH STACKED PHOTONIC DIES AND METHOD FORMING SAME

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICONDUCTOR-ON-INSULATO...

OPTICAL RECEIVER

OPTICAL COMMUNICATION SUBSTRATE USING GLASS INTERPOSER

Dicing Lines for Photonics Circuits

OPTOELECTRONIC PACKAGE

PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...

BYPASS WAVGUIDE CONFIGURED TO FACILITATE INTER-LEVEL OPTICAL COUPLI...

MULTI-TIERED SEMICONDUCTOR WAVEGUIDE AND MULTI-TIERED WAVEGUIDE HEATER

PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN

CO-PACKAGED OPTICS ASSEMBLIES