Three-layer coating

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CPC
H01L2224/29583

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29583Three-layer coating

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame
- Patent number 9,653,385
- Issue date May 16, 2017
- SDI Corporation
- Ya-Cheng Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS