-
-
POWER CHIP PACKAGING STRUCTURE
-
Publication number 20240282727
-
Publication date Aug 22, 2024
-
TONG HSING ELECTRONIC INDUSTRIES, LTD.
-
Chung-Hsiao Lien
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
SEMICONDUCTOR DEVICE
-
Publication number 20240014193
-
Publication date Jan 11, 2024
-
Rohm Co., Ltd.
-
Hiroto SAKAI
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
LOW STRESS DIRECT HYBRID BONDING
-
Publication number 20230197655
-
Publication date Jun 22, 2023
-
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
-
Jeremy Alfred Theil
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
CHIP PARTS
-
Publication number 20230102582
-
Publication date Mar 30, 2023
-
Rohm Co., Ltd.
-
Keisuke FUKAE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
DISPLAY DEVICE
-
Publication number 20210265446
-
Publication date Aug 26, 2021
-
SAMSUNG DISPLAY CO., LTD.
-
Byeong Beom KIM
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
-
-
-
Semiconductor Device
-
Publication number 20200098713
-
Publication date Mar 26, 2020
-
Rohm Co., Ltd.
-
Tadahiro Morifuji
-
H01 - BASIC ELECTRIC ELEMENTS
-
-