Three-layer coating

Industry

CPC
H01L2224/05583

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05583Three-layer coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 12,057,479
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 11,769,742
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,742,305
- Issue date Aug 29, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 11,610,970
- Issue date Mar 21, 2023
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,557,641
- Issue date Jan 17, 2023
- Samsung Display Co., Ltd.
- Byeong Beom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,387,172
- Issue date Jul 12, 2022
- Renesas Electronics Corporation
- Yoshinori Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip formed using a cover insulation layer and semico...
- Patent number 11,362,053
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads including interfacial electromigration barrier layers...
- Patent number 11,270,963
- Issue date Mar 8, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 11,152,319
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device comprising a conductiv...
- Patent number 11,043,458
- Issue date Jun 22, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Won Chul Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,897
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,004,813
- Issue date May 11, 2021
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 11,004,939
- Issue date May 11, 2021
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing high electron mobility transistor (HEMT)
- Patent number 10,861,947
- Issue date Dec 8, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,790,252
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, production method thereof, and display apparatus
- Patent number 10,756,034
- Issue date Aug 25, 2020
- BOE Technology Group Co., Ltd.
- Weiyun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 10,727,167
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Takayuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor (HEMT)
- Patent number 10,707,311
- Issue date Jul 7, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with metal structure electrically connected to...
- Patent number 10,651,140
- Issue date May 12, 2020
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20240355886
- Publication date Oct 24, 2024
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGING STRUCTURE
- Publication number 20240282727
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chung-Hsiao Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
- Publication number 20240128215
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND FABRICATION METHOD THEREOF, AND DISPLAY APPARATUS
- Publication number 20240038781
- Publication date Feb 1, 2024
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Xiaoli LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014193
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240006359
- Publication date Jan 4, 2024
- KIOXIA Corporation
- Akira NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230197791
- Publication date Jun 22, 2023
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS DIRECT HYBRID BONDING
- Publication number 20230197655
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230180556
- Publication date Jun 8, 2023
- SAMSUNG DISPLAY CO., LTD.
- BYOUNGYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE
- Publication number 20230154879
- Publication date May 18, 2023
- SK HYNIX INC.
- Si Yun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS
- Publication number 20230102582
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Keisuke FUKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PAD FABRICATION PROCESS FOR A SEMICONDUCTOR PRODUCT
- Publication number 20230061951
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20230048311
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220278061
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...
- Publication number 20220223560
- Publication date Jul 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210265446
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byeong Beom KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210233878
- Publication date Jul 29, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Masanori SHINDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20210234006
- Publication date Jul 29, 2021
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS INCLUDING INTERFACIAL ELECTROMIGRATION BARRIER LAYERS...
- Publication number 20210217716
- Publication date Jul 15, 2021
- SANDISK TECHNOLOGIES LLC
- Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210134745
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200343207
- Publication date Oct 29, 2020
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20200287004
- Publication date Sep 10, 2020
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273827
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20200273354
- Publication date Aug 27, 2020
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G05 - CONTROLLING REGULATING
Information Patent Application
Semiconductor device having a juntion portion contacting a schottky...
- Publication number 20200176572
- Publication date Jun 4, 2020
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE SEMICONDUCTOR DEVICE...
- Publication number 20200126918
- Publication date Apr 23, 2020
- Amkor Technology, Inc.
- Won Chul Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20200098713
- Publication date Mar 26, 2020
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...
- Publication number 20200020654
- Publication date Jan 16, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Three-layer coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a junction portion contacting a Schottk...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor chip and semiconductor package including the same

Semiconductor device and manufacturing method of semiconductor device

Power semiconductor chip, method for producing a power semiconducto...

Semiconductor device having a junction portion contacting a Schottk...

Display device

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor chip formed using a cover insulation layer and semico...

Bonding pads including interfacial electromigration barrier layers...

Mechanisms for forming post-passivation interconnect structure

Interconnect crack arrestor structure and methods

Micro-connection structure and manufacturing method thereof

Method of manufacturing an electronic device comprising a conductiv...

Semiconductor device

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device having a junction portion contacting a Schottk...

Methods for processing high electron mobility transistor (HEMT)

Semiconductor integrated circuit device

Semiconductor devices, methods of manufacture thereof, and packaged...

Semiconductor devices and semiconductor devices including a redistr...

Display substrate, production method thereof, and display apparatus

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Power semiconductor device and method for manufacturing power semic...

High electron mobility transistor (HEMT)

Low-temperature bonding with spaced nanorods and eutectic alloys

Semiconductor device with metal structure electrically connected to...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

POWER CHIP PACKAGING STRUCTURE

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...

DISPLAY PANEL AND FABRICATION METHOD THEREOF, AND DISPLAY APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

LOW STRESS DIRECT HYBRID BONDING

DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE

CHIP PARTS

CONTACT PAD FABRICATION PROCESS FOR A SEMICONDUCTOR PRODUCT

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

BONDING PADS INCLUDING INTERFACIAL ELECTROMIGRATION BARRIER LAYERS...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

Semiconductor device having a juntion portion contacting a schottky...

CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE SEMICONDUCTOR DEVICE...

Semiconductor Device

SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...

Interconnect Crack Arrestor Structure and Methods