Three-layer stack coating

Industry

CPC
H01L2224/45573

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45573Three-layer stack coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
- Patent number 9,997,489
- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated bonding wire and methods for bonding using same
- Patent number 9,368,470
- Issue date Jun 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating layer for a conductive structure
- Patent number 9,337,164
- Issue date May 10, 2016
- Freescale Semiconductors, Inc.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure and manufacturing method thereof for effecti...
- Patent number 8,242,594
- Issue date Aug 14, 2012
- Unimicron Technology Corp.
- Chung-Pan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with micro connecting elements and method for...
- Patent number 7,468,560
- Issue date Dec 23, 2008
- Infineon Technologies AG
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections to copper IC's
- Patent number 6,620,720
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Ralph Salvatore Moyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite lightweight copper plated aluminum wire
- Patent number 6,178,623
- Issue date Jan 30, 2001
- Totoku Electric Co., Ltd.
- hiroshi Kitazawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lead member with multiple conductive layers and specific grain size
- Patent number 6,140,583
- Issue date Oct 31, 2000
- The Fururakawa Electric Co., Ltd.
- Satoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20210050321
- Publication date Feb 18, 2021
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170271296
- Publication date Sep 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170125370
- Publication date May 4, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BONDING WIRE AND METHODS FOR BONDING USING SAME
- Publication number 20160126208
- Publication date May 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING LAYER FOR A CONDUCTIVE STRUCTURE
- Publication number 20150214177
- Publication date Jul 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CORE WIRE
- Publication number 20130319726
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264534
- Publication date Oct 21, 2010
- Unimicron Technology Corp.
- Chung-Pan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
- Publication number 20070284415
- Publication date Dec 13, 2007
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with micro connecting elements and method for...
- Publication number 20060185892
- Publication date Aug 24, 2006
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Three-layer stack coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Noble metal-coated silver wire for ball bonding and method for prod...

Method of forming an electrical contact and method of forming a chi...

Chip package and method of forming a chip package with a metal cont...

Coated bond wires for die packages and methods of manufacturing sai...

Coated bonding wire and methods for bonding using same

Coating layer for a conductive structure

Reliable wire method

Reliable wire structure and method

Connecting wire and method for manufacturing same

Chip package structure and manufacturing method thereof for effecti...

Semiconductor device with micro connecting elements and method for...

Interconnections to copper IC&#x00027;s

Composite lightweight copper plated aluminum wire

Lead member with multiple conductive layers and specific grain size

Patents Applicationslast 30 patents

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

COATED BONDING WIRE AND METHODS FOR BONDING USING SAME

COATING LAYER FOR A CONDUCTIVE STRUCTURE

RELIABLE WIRE STRUCTURE AND METHOD

MULTI-CORE WIRE

RELIABLE WIRE STRUCTURE AND METHOD

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS

Semiconductor device with micro connecting elements and method for...

Interconnections to copper IC's