Tin [Sn] as principal constituent

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H01L2224/29311

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29311Tin [Sn] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin particles, electrically conductive particles, electrically co...
- Patent number 12,122,885
- Issue date Oct 22, 2024
- Sekisui Chemical Co., Ltd.
- Kouki Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver sintering composition containing copper alloy for metal bonding
- Patent number 12,051,522
- Issue date Jul 30, 2024
- Henkel AG & Co. KGaA
- Wei Yao
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating circuit components in matrix batches
- Patent number 11,521,862
- Issue date Dec 6, 2022
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and nanoparticle mounting material
- Patent number 11,515,280
- Issue date Nov 29, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyohiro Hine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display panel comprising micro light-emitting diodes and a connecti...
- Patent number 11,355,484
- Issue date Jun 7, 2022
- Interface Technology (ChengDu) Co., Ltd.
- Po-Ching Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member connection method and adhesive tape
- Patent number 11,342,303
- Issue date May 24, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tetsuyuki Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive agent composition, and electricall...
- Patent number 11,306,225
- Issue date Apr 19, 2022
- Furukawa Electric Co., Ltd.
- Shunichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,230,649
- Issue date Jan 25, 2022
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,193,047
- Issue date Dec 7, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,136,479
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laser bonding method
- Patent number 11,107,790
- Issue date Aug 31, 2021
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,098,226
- Issue date Aug 24, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,066,577
- Issue date Jul 20, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240347012
- Publication date Oct 17, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...
- Publication number 20240243033
- Publication date Jul 18, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...
- Publication number 20230106977
- Publication date Apr 6, 2023
- Sekisui Chemical Co., Ltd
- Kouki OOKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING
- Publication number 20220319733
- Publication date Oct 6, 2022
- Henkel AG & Co., KGaA
- Wei Yao
- B22 - CASTING POWDER METALLURGY
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...
- Publication number 20220139864
- Publication date May 5, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
- Publication number 20210358885
- Publication date Nov 18, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL COMPRISING MICRO LIGHT-EMITTING DIODES AND METHOD FOR...
- Publication number 20210183835
- Publication date Jun 17, 2021
- Interface Technology (ChengDu) Co., Ltd.
- PO-CHING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER CONNECTION METHOD AND ADHESIVE TAPE
- Publication number 20210074674
- Publication date Mar 11, 2021
- Hitachi Chemical Company, Ltd.
- Tetsuyuki SHIRAKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210066243
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD OF THE DISPLAY PANEL
- Publication number 20210013169
- Publication date Jan 14, 2021
- SAKAI DISPLAY PRODUCTS CORPORATION
- SHINICHI SUGIMOTO
- G02 - OPTICS
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20200203304
- Publication date Jun 25, 2020
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL
- Publication number 20200185347
- Publication date Jun 11, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LASER BONDING METHOD
- Publication number 20200075535
- Publication date Mar 5, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...
- Publication number 20190300651
- Publication date Oct 3, 2019
- Hitachi Chemical Company, Ltd.
- Masaki TAKEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...
- Publication number 20190206831
- Publication date Jul 4, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL WITH ION SCAVENGER
- Publication number 20190048245
- Publication date Feb 14, 2019
- HONEYWELL INTERNATIONAL INC.
- Ya Qun Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20190016928
- Publication date Jan 17, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20190016929
- Publication date Jan 17, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin particles, electrically conductive particles, electrically co...

Semiconductor device and a method of manufacturing thereof

Connection structure and manufacturing method therefor

Silver sintering composition containing copper alloy for metal bonding

Thermal interface material, an integrated circuit formed therewith,...

Solder material and method for die attachment

Hybrid bonding structures and semiconductor devices including the same

Process for fabricating circuit components in matrix batches

Mounting structure and nanoparticle mounting material

Semiconductor device and a method of manufacturing thereof

Alternative compositions for high temperature soldering applications

Advanced solder alloys for electronic interconnects

Sintering materials and attachment methods using same

Display panel comprising micro light-emitting diodes and a connecti...

Member connection method and adhesive tape

Electrically conductive adhesive agent composition, and electricall...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Laser bonding method

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Alignment method, method for connecting electronic component, metho...

Semiconductor device and a method of manufacturing thereof

Electronic element and electronic device comprising the same

Sintering pastes with high metal loading for semiconductor die atta...

Curing a heat-curable material in an embedded curing zone

Electrically conductive composition

Engineered polymer-based electronic materials

Low-temperature bonding with spaced nanorods and eutectic alloys

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

Core-Shell Particle Die-Attach Material

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

LIQUID METAL THERMAL INTERFACE

SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...

DISPLAY PANEL COMPRISING MICRO LIGHT-EMITTING DIODES AND METHOD FOR...

MEMBER CONNECTION METHOD AND ADHESIVE TAPE

MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME

DISPLAY PANEL AND MANUFACTURING METHOD OF THE DISPLAY PANEL

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL

LASER BONDING METHOD

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

THERMAL INTERFACE MATERIAL WITH ION SCAVENGER

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...