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Tin [Sn] as principal constituent
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CPC
H01L2224/13911
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13911
Tin [Sn] as principal constituent
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic packages with nanoparticle joining
Patent number
9,397,063
Issue date
Jul 19, 2016
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Microelectronic packages with nanoparticle joining
Patent number
9,030,001
Issue date
May 12, 2015
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Microelectronic packages with nanoparticle joining
Patent number
8,580,607
Issue date
Nov 12, 2013
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
Publication number
20140077351
Publication date
Mar 20, 2014
Tessera, Inc.
Belgacem Haba
B82 - NANO-TECHNOLOGY
Information
Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
Publication number
20120025365
Publication date
Feb 2, 2012
Tessera Research LLC
Belgacem Haba
B82 - NANO-TECHNOLOGY