Tin [Sn] as principal constituent

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H01L2224/29611

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29611Tin [Sn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure, semiconductor device, and method of manufacturing...
- Patent number 11,764,183
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Koji Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit carrier including a silicone polymer coating
- Patent number 9,754,850
- Issue date Sep 5, 2017
- Robert Bosch GmbH
- Isabel Faria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with conductive clips
- Patent number 9,620,471
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded semiconductor package with wettable flank
- Patent number 9,324,637
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor package
- Patent number 7,466,012
- Issue date Dec 16, 2008
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, D...
- Publication number 20230215851
- Publication date Jul 6, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhijun LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING...
- Publication number 20210343676
- Publication date Nov 4, 2021
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
- Publication date Jan 21, 2021
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20200135690
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20150262967
- Publication date Sep 17, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clips
- Publication number 20150262960
- Publication date Sep 17, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor package
- Publication number 20090008804
- Publication date Jan 8, 2009
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor package
- Publication number 20060131760
- Publication date Jun 22, 2006
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration and bonding of micro-devices into system substrate

Joint structure, semiconductor device, and method of manufacturing...

Methods for bonding substrates

Integration and bonding of micro-devices into system substrate

Circuit carrier including a silicone polymer coating

Power semiconductor package with conductive clips

Bump package and methods of formation thereof

Quad flat non-leaded semiconductor package with wettable flank

Hermetically sealed wafer packages

Method and structure for wafer to wafer bonding in semiconductor pa...

Solder preform and electronic component

Power semiconductor package

Patents Applicationslast 30 patents

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, D...

JOINT STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

METHODS FOR BONDING SUBSTRATES

HERMETICALLY SEALED WAFER PACKAGES

Power Semiconductor Package with Conductive Clips

Bump Package and Methods of Formation Thereof

HERMETICALLY SEALED WAFER PACKAGES

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

Solder Preform and Electronic Component

Power semiconductor package

Power semiconductor package