Tin [Sn] as principal constituent

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CPC
H01L2224/37611

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37611Tin [Sn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 10,985,093
- Issue date Apr 20, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 10,622,288
- Issue date Apr 14, 2020
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection member with bulk body and electrically and thermally con...
- Patent number 10,366,946
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding material and method for packaging semiconductor chips
- Patent number 9,209,152
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 8,451,621
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method of manufacture
- Patent number 8,449,339
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter and vehicle drive unit using the same
- Patent number 7,589,400
- Issue date Sep 15, 2009
- Hitachi, Ltd.
- Hiroshi Hozoji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20200211937
- Publication date Jul 2, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20190139873
- Publication date May 9, 2019
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection member with bulk body and electrically and thermally con...
- Publication number 20190131218
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Wu Hu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE
- Publication number 20120064781
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20120063107
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inverter and vehicle drive unit using the same
- Publication number 20060071860
- Publication date Apr 6, 2006
- Hiroshi Hozoji
- H01 - BASIC ELECTRIC ELEMENTS

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for producing semiconductor device

Semiconductor device and method for producing semiconductor device

Connection member with bulk body and electrically and thermally con...

Semiconductor module

Lead for connection to a semiconductor device

Molding material and method for packaging semiconductor chips

Semiconductor component and method of manufacture

Connector assembly and method of manufacture

Inverter and vehicle drive unit using the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Connection member with bulk body and electrically and thermally con...

Molding Material and Method for Packaging Semiconductor Chips

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Inverter and vehicle drive unit using the same