Tin [Sn] as principal constituent

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H01L2224/80411

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80411Tin [Sn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Package structure and manufacturing method thereof
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- Issue date Jul 27, 2021
- Innolux Corporation
- Hsueh-Hsuan Chou
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Patents Applicationslast 30 patents

Information Patent Application
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Information Patent Application
CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND...
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ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
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Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
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