Tin [Sn] as principal constituent

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13211Tin [Sn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing a chip-card module with soldered electron...
- Patent number 11,894,295
- Issue date Feb 6, 2024
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion soldering preform with varying surface profile
- Patent number 11,764,185
- Issue date Sep 19, 2023
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,682,646
- Issue date Jun 20, 2023
- MARVELL ASIA PTE. LTD.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,658,277
- Issue date May 23, 2023
- OSRAM OLED GmbH
- Guido Weiss
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flip-chip flexible under bump metallization size
- Patent number 11,557,557
- Issue date Jan 17, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element mounting structure, and combination of semico...
- Patent number 11,444,054
- Issue date Sep 13, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device structure with bonding pad and method for form...
- Patent number 11,222,859
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder in a photonic device
- Patent number 11,181,689
- Issue date Nov 23, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,171,104
- Issue date Nov 9, 2021
- Marvell Asia Pte, Ltd.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,094,866
- Issue date Aug 17, 2021
- OSRAM OLED GmbH
- Guido Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of forming the same
- Patent number 10,020,273
- Issue date Jul 10, 2018
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 8,939,347
- Issue date Jan 27, 2015
- Intel Corporation
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solder and electrically conductive adhesive based interconnection f...
- Patent number 8,592,299
- Issue date Nov 26, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 6,764,938
- Issue date Jul 20, 2004
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 6,608,381
- Issue date Aug 19, 2003
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 5,977,637
- Issue date Nov 2, 1999
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 5,611,481
- Issue date Mar 18, 1997
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
- Publication number 20230065738
- Publication date Mar 2, 2023
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Manufacturing a Chip-Card Module with Soldered Electron...
- Publication number 20220139818
- Publication date May 5, 2022
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20220102603
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
- Publication number 20210407939
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20210351144
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
- Publication number 20210336111
- Publication date Oct 28, 2021
- OSRAM OLED GmbH
- Guido Weiss
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
- Publication number 20210125952
- Publication date Apr 29, 2021
- Marvell International Ltd.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE
- Publication number 20210088722
- Publication date Mar 25, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...
- Publication number 20200273837
- Publication date Aug 27, 2020
- Hitachi Chemical Company, Ltd.
- Hitoshi ONOZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
- Publication number 20200028045
- Publication date Jan 23, 2020
- Osram Opto Semiconductors GmbH
- Guido Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...
- Publication number 20190229098
- Publication date Jul 25, 2019
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Solder Alloys For Electronic Interconnects
- Publication number 20190157535
- Publication date May 23, 2019
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Solder Alloys For Electronic Interconnects
- Publication number 20180102464
- Publication date Apr 12, 2018
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20170148753
- Publication date May 25, 2017
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
- Publication number 20130088839
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT
- Publication number 20110266030
- Publication date Nov 3, 2011
- Rajasekaran Swaminathan
- B82 - NANO-TECHNOLOGY
Information Patent Application
Microstructure Apparatus and Method for Manufacturing Microstructur...
- Publication number 20100059244
- Publication date Mar 11, 2010
- KYOCERA CORPORATION
- Itaru Ishii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated electronic device having flip-chip connection with circu...
- Publication number 20040209453
- Publication date Oct 21, 2004
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING FLIP-CHIP CONNECTION WITH CIRCU...
- Publication number 20020050404
- Publication date May 2, 2002
- TOSHIYA AKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process for manufacturing a chip-card module with soldered electron...

Diffusion soldering preform with varying surface profile

IC chip package with dummy solder structure under corner, and relat...

Method for producing an optoelectronic component, and optoelectroni...

Flip-chip flexible under bump metallization size

Semiconductor element mounting structure, and combination of semico...

Advanced solder alloys for electronic interconnects

Semiconductor device structure with bonding pad and method for form...

Low temperature solder in a photonic device

IC chip package with dummy solder structure under corner, and relat...

Method for producing an optoelectronic component, and optoelectroni...

Lead free solder columns and methods for making same

Structures and methods to enable a full intermetallic interconnect

Method for producing metal ball, joining material, and metal ball

Semiconductor devices and methods of forming the same

Magnetic intermetallic compound interconnect

Solder and electrically conductive adhesive based interconnection f...

Doping minor elements into metal bumps

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Patents Applicationslast 30 patents

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE

Process for Manufacturing a Chip-Card Module with Soldered Electron...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

Method for Producing an Optoelectronic Component, and Optoelectroni...

IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...

LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE

SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...

Method for Producing an Optoelectronic Component, and Optoelectroni...

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF AND DISPLAY MOD...

Advanced Solder Alloys For Electronic Interconnects

Advanced Solder Alloys For Electronic Interconnects

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...

Doping Minor Elements into Metal Bumps

Doping Minor Elements into Metal Bumps

MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT

Microstructure Apparatus and Method for Manufacturing Microstructur...

Integrated electronic device having flip-chip connection with circu...

INTEGRATED ELECTRONIC DEVICE HAVING FLIP-CHIP CONNECTION WITH CIRCU...