Membership
Tour
Register
Log in
Tin [Sn] as principal constituent
Follow
Industry
CPC
H01L2224/37111
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/37111
Tin [Sn] as principal constituent
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Optical module
Patent number
11,736,197
Issue date
Aug 22, 2023
CIG PHOTONICS JAPAN LIMITED
Daisuke Noguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for electrically contacting a component by galvanic connecti...
Patent number
11,037,862
Issue date
Jun 15, 2021
Siemens Aktiengesellschaft
Hubert Baueregger
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Clip and related methods
Patent number
10,121,763
Issue date
Nov 6, 2018
Semiconductor Components Industries, LLC
Chee Hiong Chew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clip and related methods
Patent number
9,911,712
Issue date
Mar 6, 2018
Semiconductor Components Industries, LLC
Chee Hiong Chew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
Patent number
8,853,835
Issue date
Oct 7, 2014
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
OPTICAL MODULE
Publication number
20220103262
Publication date
Mar 31, 2022
CIG Photonics Japan Limited
Daisuke NOGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLIP AND RELATED METHODS
Publication number
20180197836
Publication date
Jul 12, 2018
Semiconductor Components Industries, LLC
Chee Hiong CHEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
Publication number
20140097528
Publication date
Apr 10, 2014
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS