Tin [Sn] as principal constituent

Industry

CPC
H01L2224/13411

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13411Tin [Sn] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal particle and articles formed therefrom
- Patent number 10,507,551
- Issue date Dec 17, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal particle and electroconductive paste formed therefrom
- Patent number 10,478,924
- Issue date Nov 19, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package with SoC and integrated memory
- Patent number 10,290,620
- Issue date May 14, 2019
- Apple Inc.
- John Bruno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball
- Patent number 10,147,695
- Issue date Dec 4, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particles having intermetallic compound nano-composite struct...
- Patent number 10,016,848
- Issue date Jul 10, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with SoC and integrated memory
- Patent number 9,595,514
- Issue date Mar 14, 2017
- Apple Inc.
- John Bruno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number 9,397,021
- Issue date Jul 19, 2016
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with SoC and integrated memory
- Patent number 9,331,058
- Issue date May 3, 2016
- Apple Inc.
- John Bruno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,812,549
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,596,634
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,281,105
- Issue date Aug 28, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,221,503
- Issue date Apr 24, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,013,713
- Issue date Jan 11, 2000
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM
- Publication number 20180311771
- Publication date Nov 1, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE AND ARTICLES FORMED THEREFROM
- Publication number 20180290243
- Publication date Oct 11, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE
- Publication number 20170282302
- Publication date Oct 5, 2017
- NAPRA CO., LTD.
- Shigenobu SEKINE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20030060000
- Publication date Mar 27, 2003
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20020127839
- Publication date Sep 12, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering materials and attachment methods using same

Metal particle and articles formed therefrom

Metal particle and electroconductive paste formed therefrom

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Package with SoC and integrated memory

Cu core ball

Metal particles having intermetallic compound nano-composite struct...

Magnetic intermetallic compound interconnect

Electrode connection structure and electrode connection method

Package with SoC and integrated memory

Electrical connector

Package with SoC and integrated memory

Junction and electrical connection

Wiring board and fabricating method thereof, semiconductor device a...

Wiring board and fabricating method thereof, semiconductor device a...

Electrode modification using an unzippable polymer paste

Electrode modification using an unzippable polymer paste

Electrode modification using an unzippable polymer paste

Patents Applicationslast 30 patents

METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM

METAL PARTICLE AND ARTICLES FORMED THEREFROM

METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE

Wiring board and fabricating method thereof, semiconductor device a...

Wiring board and fabricating method thereof, semiconductor device a...