TREA

Tin [Sn] as principal constituent

Follow

Industry

  • CPC
  • H01L2224/83611
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83611Tin [Sn] as principal constituent
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic element unit and reinforcing adhesive agent
    • Patent number 8,686,299
    • Issue date Apr 1, 2014
    • Panasonic Corporation
    • Koji Motomura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device
    • Patent number 8,217,403
    • Issue date Jul 10, 2012
    • Napra Co., Ltd
    • Shigenobu Sekine
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents