Tin [Sn] as principal constituent

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H01L2224/05811

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05811Tin [Sn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,935,044
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,355,927
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiu-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,964,964
- Issue date Jun 21, 2011
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,618,844
- Issue date Nov 17, 2009
- Intelleflex Corporation
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20100038770
- Publication date Feb 18, 2010
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20070040272
- Publication date Feb 22, 2007
- INTELLEFLEX CORPORATION
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR