TiO2

Industry

CPC
H01L2924/05341

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/05341TiO2

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for wavelength conversion using layers of different photo...
- Patent number 11,765,477
- Issue date Sep 19, 2023
- Sony Group Corporation
- Atsushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor, image capturing system, and production method of imag...
- Patent number 11,122,227
- Issue date Sep 14, 2021
- Sony Corporation
- Atsushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Image sensor, image capturing system, and production method of imag...
- Patent number 10,681,292
- Issue date Jun 9, 2020
- Sony Corporation
- Atsushi Toda
- G01 - MEASURING TESTING
Information Patent Grant
Methods of forming microelectronic structures having a patterned su...
- Patent number 10,354,966
- Issue date Jul 16, 2019
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 10,269,743
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bonding interface layer
- Patent number 10,079,471
- Issue date Sep 18, 2018
- Hewlett Packard Enterprise Development LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including a reflective layer
- Patent number 10,062,660
- Issue date Aug 28, 2018
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-semiconductor contact structure with doped interlayer
- Patent number 10,049,925
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a patterned surface structure and se...
- Patent number 10,008,461
- Issue date Jun 26, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-semiconductor contact structure with doped interlayer
- Patent number 9,466,488
- Issue date Oct 11, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,368,436
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode for low-leakage devices
- Patent number 9,245,941
- Issue date Jan 26, 2016
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of anisotropic dielectric layers orientationally matched...
- Patent number 9,178,011
- Issue date Nov 3, 2015
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 6,812,123
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321792
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE COATING APPARATUS
- Publication number 20240194632
- Publication date Jun 13, 2024
- Woong Chul SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240006359
- Publication date Jan 4, 2024
- KIOXIA Corporation
- Akira NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
- Publication number 20230412941
- Publication date Dec 21, 2023
- SONY GROUP CORPORATION
- Atsushi TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...
- Publication number 20230260956
- Publication date Aug 17, 2023
- SK HYNIX INC.
- Mir IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE
- Publication number 20230230892
- Publication date Jul 20, 2023
- NEXPERIA B.V.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230062835
- Publication date Mar 2, 2023
- KIOXIA Corporation
- Takuya KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR
- Publication number 20220367771
- Publication date Nov 17, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
- Publication number 20210377471
- Publication date Dec 2, 2021
- SONY GROUP CORPORATION
- Atsushi TODA
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...
- Publication number 20210202417
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20200303202
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
- Publication number 20200244904
- Publication date Jul 30, 2020
- SONY CORPORATION
- Atsushi Toda
- G01 - MEASURING TESTING
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20190304796
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING MICROELECTRONIC STRUCTURES HAVING A PATTERNED SU...
- Publication number 20190273058
- Publication date Sep 5, 2019
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190244919
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
- Publication number 20180367746
- Publication date Dec 20, 2018
- SONY CORPORATION
- Atsushi Toda
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES HAVING A PATTERNED SURF...
- Publication number 20180247906
- Publication date Aug 30, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING INTERFACE LAYER
- Publication number 20180013260
- Publication date Jan 11, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING A REFLECTIVE LAYER
- Publication number 20170287867
- Publication date Oct 5, 2017
- Trillion Science, Inc.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170221843
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...
- Publication number 20170162531
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Youn Jo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160358868
- Publication date Dec 8, 2016
- Inotera Memories, Inc.
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160260658
- Publication date Sep 8, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160035654
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-SEMICONDUCTOR CONTACT STRUCTURE WITH DOPED INTERLAYER
- Publication number 20150325484
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20150179478
- Publication date Jun 25, 2015
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode for Low-Leakage Devices
- Publication number 20140273427
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of Anisotropic Dielectric Layers Orientationally Matched...
- Publication number 20140264747
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Chemical bonding method, package-type electronic component, and hyb...

Apparatus for wavelength conversion using layers of different photo...

Microelectronic devices and apparatuses having a patterned surface...

Dry etch process landing on metal oxide etch stop layer over metal...

Image sensor, image capturing system, and production method of imag...

Methods of forming microelectronic devices having a patterned surfa...

Dry etch process landing on metal oxide etch stop layer over metal...

Image sensor, image capturing system, and production method of imag...

Methods of forming microelectronic structures having a patterned su...

Semiconductor devices and methods of manufacture thereof

Composition for anisotropic conductive film, anisotropic conductive...

Bonding interface layer

Anisotropic conductive film including a reflective layer

Metal-semiconductor contact structure with doped interlayer

Semiconductor structure having a patterned surface structure and se...

Source down semiconductor devices and methods of formation thereof

Narrow-gap flip chip underfill composition

Metal-semiconductor contact structure with doped interlayer

Source down semiconductor devices and methods of formation thereof

Narrow-gap flip chip underfill composition

Electrode for low-leakage devices

Deposition of anisotropic dielectric layers orientationally matched...

Semiconductor devices and methods for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

WIRE COATING APPARATUS

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...

SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...

CHIP-SCALE PACKAGE

SEMICONDUCTOR DEVICE

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...

MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

METHODS OF FORMING MICROELECTRONIC STRUCTURES HAVING A PATTERNED SU...

Semiconductor Devices and Methods of Manufacture Thereof

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...

METHODS OF FORMING SEMICONDUCTOR STRUCTURES HAVING A PATTERNED SURF...

BONDING INTERFACE LAYER

ANISOTROPIC CONDUCTIVE FILM INCLUDING A REFLECTIVE LAYER

Semiconductor Devices and Methods of Manufacture Thereof

COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...

CONNECTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Source Down Semiconductor Devices and Methods of Formation Thereof

Source Down Semiconductor Devices and Methods of Formation Thereof

METAL-SEMICONDUCTOR CONTACT STRUCTURE WITH DOPED INTERLAYER

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

Electrode for Low-Leakage Devices

Deposition of Anisotropic Dielectric Layers Orientationally Matched...