Titanium [Ti] as principal constituent

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H01L2224/83466

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83466Titanium [Ti] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,062,637
- Issue date Aug 13, 2024
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having conductive particle between pads
- Patent number 11,217,557
- Issue date Jan 4, 2022
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,615,747
- Issue date Apr 7, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Micro-bonding structure and method of forming the same
- Patent number 10,388,627
- Issue date Aug 20, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate with alternating pattern of diamond and metal o...
- Patent number 9,812,375
- Issue date Nov 7, 2017
- II-VI Incorporated
- Wen-Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,988
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,841,768
- Issue date Sep 23, 2014
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate
- Patent number 8,736,077
- Issue date May 27, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for joining a silicon plate to a second plate
- Patent number 6,955,975
- Issue date Oct 18, 2005
- Robert Bosch GmbH
- Frank Reichenbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240363582
- Publication date Oct 31, 2024
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220084982
- Publication date Mar 17, 2022
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200365551
- Publication date Nov 19, 2020
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130234298
- Publication date Sep 12, 2013
- Kabushiki Kaisha Toshiba
- Satoshi MITSUGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE
- Publication number 20130037967
- Publication date Feb 14, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for joining a silicon plate to a second plate
- Publication number 20040082145
- Publication date Apr 29, 2004
- Frank Reichenbach
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Titanium [Ti] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Chip assembly

Electronic device having conductive particle between pads

Method for electrically contacting a component by galvanic connecti...

Method and apparatus for creating a bond between objects based on f...

Chip assembly

Vibrator device, oscillator, electronic device, and vehicle

Micro-bonding structure and method of forming the same

Light emitting device and light emitting module

Method of forming a chip assembly with a die attach liquid

Composite substrate with alternating pattern of diamond and metal o...

Semiconductor device

Semiconductor device

Chip package and a method for manufacturing a chip package

Semiconductor package substrate

Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

Method for joining a silicon plate to a second plate

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

JOINT STRUCTURE

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

ELECTRONIC DEVICE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE SUBSTRATE

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Method for joining a silicon plate to a second plate