Titanium [Ti] as principal constituent

Industry

CPC
H01L2224/13366

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13366Titanium [Ti] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for forming contacts on a semiconductor component by alignin...
- Patent number 6,283,358
- Issue date Sep 4, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for forming contacts on a semiconductor component...
- Patent number 6,186,392
- Issue date Feb 13, 2001
- Micron Technology, Inc.
- Michael Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100171221
- Publication date Jul 8, 2010
- Akihiro CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Titanium [Ti] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive connecting member and manufacturing method of same

Method for producing metal ball, joining material, and metal ball

Package on package structure and method of manufacturing the same

Semiconductor device and manufacturing method thereof

System for forming contacts on a semiconductor component by alignin...

Method and system for forming contacts on a semiconductor component...

Patents Applicationslast 30 patents

PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF