Membership
Tour
Register
Log in
Titanium [Ti] as principal constituent
Follow
Industry
CPC
H01L2224/37166
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/37166
Titanium [Ti] as principal constituent
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for electrically contacting a component by galvanic connecti...
Patent number
11,037,862
Issue date
Jun 15, 2021
Siemens Aktiengesellschaft
Hubert Baueregger
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR