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Titanium [Ti] as principal constituent
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CPC
H01L2224/29466
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29466
Titanium [Ti] as principal constituent
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last 30 patents
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Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
Patent number
9,490,228
Issue date
Nov 8, 2016
Cheil Industries, Inc.
Kyoung Soo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
Patent number
9,478,326
Issue date
Oct 25, 2016
Sekisui Chemical Co., Ltd.
Hiroya Ishida
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
Publication number
20220246510
Publication date
Aug 4, 2022
HYPERTAC S.P.A.
Alessandro Bosca
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...
Publication number
20170271299
Publication date
Sep 21, 2017
BOE TECHNOLOGY GROUP CO., LTD.
HONG LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
Publication number
20140291869
Publication date
Oct 2, 2014
Kyoung Soo PARK
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Method for Producing a Metal Layer on a Substrate and Device
Publication number
20120292773
Publication date
Nov 22, 2012
INFINEON TECHNOLOGIES AG
Khalil Hosseini
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...