Titanium [Ti] as principal constituent

Industry

CPC
H01L2224/29366

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29366Titanium [Ti] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Nanowires plated on nanoparticles
- Patent number 11,869,864
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowires plated on nanoparticles
- Patent number 11,282,807
- Issue date Mar 22, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 10,325,834
- Issue date Jun 18, 2019
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 9,773,719
- Issue date Sep 26, 2017
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,583,413
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
- Patent number 9,490,228
- Issue date Nov 8, 2016
- Cheil Industries, Inc.
- Kyoung Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating resin film, bonded structure using insulating resin film...
- Patent number 9,426,896
- Issue date Aug 23, 2016
- Dexerials Corporation
- Daisuke Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,252,117
- Issue date Feb 2, 2016
- Cheil Industries, Inc.
- Kyoung Hun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and electronic device including the same
- Patent number 9,048,240
- Issue date Jun 2, 2015
- Cheil Industries, Inc.
- Young Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing wafer-bonded semiconductor device
- Patent number 8,889,441
- Issue date Nov 18, 2014
- Hitachi, Ltd.
- Toshiaki Takai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for semiconductor bonding, adhesive film for semiconductor...
- Patent number 8,692,394
- Issue date Apr 8, 2014
- Sekisui Chemical Co., Ltd.
- Yangsoo Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Power module using sintering die attach and manufacturing method th...
- Patent number 8,630,097
- Issue date Jan 14, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element mounting board
- Patent number 8,598,719
- Issue date Dec 3, 2013
- Sumitomo Bakelite Company Limited
- Mitsuo Sugino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged electronic device having metal comprising self-healing die...
- Patent number 8,378,506
- Issue date Feb 19, 2013
- Texas Instruments Incorporated
- James C Wainerdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having metal comprising self-healing die...
- Patent number 7,972,905
- Issue date Jul 5, 2011
- Texas Instruments Incorporated
- James C. Wainerdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonding material comprising metal particles and bon...
- Patent number 7,955,411
- Issue date Jun 7, 2011
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES PLATED ON NANOPARTICLES
- Publication number 20220189903
- Publication date Jun 16, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES PLATED ON NANOPARTICLES
- Publication number 20200321302
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Fabrication Thereof
- Publication number 20170365539
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulating Resin Film, Bonded Structure Using Insulating Resin Film...
- Publication number 20140251537
- Publication date Sep 11, 2014
- DEXERIALS CORPORATION
- Daisuke SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140159229
- Publication date Jun 12, 2014
- Kyoung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semicondutor Packages and Methods of Fabrication Thereof
- Publication number 20140145319
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20130168847
- Publication date Jul 4, 2013
- Young Woo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WAFER-BONDED SEMICONDUCTOR DEVICE
- Publication number 20130029438
- Publication date Jan 31, 2013
- Toshiaki Takai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR...
- Publication number 20120267803
- Publication date Oct 25, 2012
- Sekisui Chemical Co., Ltd
- Yangsoo Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Insulating Resin Film, Bonded Structure Using Insulating Resin Film...
- Publication number 20120125671
- Publication date May 24, 2012
- Daisuke Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE USING SINTERING DIE ATTACH AND MANUFACTURING METHOD TH...
- Publication number 20120106109
- Publication date May 3, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device Having Metal Comprising Self-Healing Die...
- Publication number 20110227233
- Publication date Sep 22, 2011
- TEXAS INSTRUMENTS INCORPORATED
- JAMES C. WAINERDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20110204125
- Publication date Aug 25, 2011
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING BOARD
- Publication number 20110084409
- Publication date Apr 14, 2011
- Mitsuo Sugino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING...
- Publication number 20100264553
- Publication date Oct 21, 2010
- TEXAS INSTRUMENTS INCORPORATED
- JAMES C. WAINERDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100207263
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20080173398
- Publication date Jul 24, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...
- Publication number 20080160183
- Publication date Jul 3, 2008
- Eiichi Ide
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Nano-metal composite made by deposition from colloidal suspensions
- Publication number 20050127134
- Publication date Jun 16, 2005
- Guo-Quan Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Titanium [Ti] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanowires plated on nanoparticles

Nanowires plated on nanoparticles

Electrically conductive composition

Nanoscale interconnect array for stacked dies

Semiconductor packages and methods of fabrication thereof

Conductive connecting member and manufacturing method of same

Laser die backside film removal for integrated circuit (IC) packaging

Semiconductor packages and methods of fabrication thereof

Semiconductor device

Anisotropic conductive film including conductive adhesive layer and...

Insulating resin film, bonded structure using insulating resin film...

Laser die backside film removal for integrated circuit (IC) packaging

Semiconductor device connected by anisotropic conductive film

Anisotropic conductive film and electronic device including the same

Method for manufacturing wafer-bonded semiconductor device

Electrically conductive bonding material, method of bonding with th...

Low temperature bonding material comprising coated metal nanopartic...

Adhesive for semiconductor bonding, adhesive film for semiconductor...

Power module using sintering die attach and manufacturing method th...

Semiconductor element mounting board

Packaged electronic device having metal comprising self-healing die...

Packaged electronic device having metal comprising self-healing die...

Low temperature bonding material comprising metal particles and bon...

Patents Applicationslast 30 patents

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

NANOWIRES PLATED ON NANOPARTICLES

NANOWIRES PLATED ON NANOPARTICLES

Semiconductor Packages and Methods of Fabrication Thereof

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

Insulating Resin Film, Bonded Structure Using Insulating Resin Film...

Semiconductor Modules and Methods of Formation Thereof

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

Semicondutor Packages and Methods of Fabrication Thereof

ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION

METHOD FOR MANUFACTURING WAFER-BONDED SEMICONDUCTOR DEVICE

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR...

Insulating Resin Film, Bonded Structure Using Insulating Resin Film...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

POWER MODULE USING SINTERING DIE ATTACH AND MANUFACTURING METHOD TH...

Packaged Electronic Device Having Metal Comprising Self-Healing Die...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR ELEMENT MOUNTING BOARD

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...

PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING...

SEMICONDUCTOR DEVICE

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...

Nano-metal composite made by deposition from colloidal suspensions