Membership
Tour
Register
Log in
Titanium [Ti] as principal constituent
Follow
Industry
CPC
H01L2224/29666
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/29666
Titanium [Ti] as principal constituent
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Bonding structures and methods for forming the same
Patent number
11,837,568
Issue date
Dec 5, 2023
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductor design for integrated magnetic devices
Patent number
11,393,787
Issue date
Jul 19, 2022
Texas Instruments Incorporated
Dok Won Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for bonding substrates
Patent number
11,309,278
Issue date
Apr 19, 2022
Applied Materials, Inc.
Prayudi Lianto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
11,049,833
Issue date
Jun 29, 2021
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing same
Patent number
10,468,375
Issue date
Nov 5, 2019
Mitsubishi Electric Corporation
Koji Yamazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for coating and bonding substrates
Patent number
9,358,765
Issue date
Jun 7, 2016
EV Group E. Thallner GmbH
Markus Wimplinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
Patent number
8,546,956
Issue date
Oct 1, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component mounting structure
Patent number
8,497,432
Issue date
Jul 30, 2013
Seiko Epson Corporation
Nobuaki Hashimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
Patent number
8,431,436
Issue date
Apr 30, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
Patent number
7,375,427
Issue date
May 20, 2008
Seiko Epson Corporation
Shuichi Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Electroless Die-Attach Process for Semiconductor Packaging
Publication number
20240274514
Publication date
Aug 15, 2024
Wolfspeed, Inc.
Afshin Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
Publication number
20220344298
Publication date
Oct 27, 2022
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR BONDING SUBSTRATES
Publication number
20200135690
Publication date
Apr 30, 2020
Applied Materials, Inc.
PRAYUDI LIANTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20190221540
Publication date
Jul 18, 2019
MITSUBISHI ELECTRIC CORPORATION
Koji YAMAZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
Publication number
20190164934
Publication date
May 30, 2019
TEXAS INSTRUMENTS INCORPORATED
Dok Won Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20170133341
Publication date
May 11, 2017
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
Publication number
20150340338
Publication date
Nov 26, 2015
TEXAS INSTRUMENTS INCORPORATED
Dok Won Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
Publication number
20130200520
Publication date
Aug 8, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
Publication number
20130113106
Publication date
May 9, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
Publication number
20100071946
Publication date
Mar 25, 2010
SEIKO EPSON CORPORATION
Nobuaki HASHIMOTO
G02 - OPTICS
Information
Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
Publication number
20060091539
Publication date
May 4, 2006
Seiko Epson Corporation
Shuichi Tanaka
G02 - OPTICS