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Titanium [Ti] as principal constituent
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CPC
H01L2224/13466
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/13466
Titanium [Ti] as principal constituent
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Patent Grant
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
Patent number
12,057,429
Issue date
Aug 6, 2024
HRL Laboratories, LLC
Aurelio Lopez
H01 - BASIC ELECTRIC ELEMENTS