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Titanium [Ti] as principal constituent
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CPC
H01L2224/80466
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/80466
Titanium [Ti] as principal constituent
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last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240250039
Publication date
Jul 25, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240250038
Publication date
Jul 25, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS