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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,424,220
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with organic photodiodes and methods for forming the...
- Patent number 11,404,484
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically testable integrated circuit packaging
- Patent number 11,164,801
- Issue date Nov 2, 2021
- pSemi Corporation
- Mark Moffat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 11,152,342
- Issue date Oct 19, 2021
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 11,088,268
- Issue date Aug 10, 2021
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including EMI shielding structure and method...
- Patent number 10,978,406
- Issue date Apr 13, 2021
- Mediatek Inc.
- Hung-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for an electronic component, in particular a semiconductor...
- Patent number 10,903,160
- Issue date Jan 26, 2021
- POSSEHL ELECTRONICS DEUTSCHLAND GMBH
- Dietmar Kurzeja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-phase switching unit
- Patent number 10,873,267
- Issue date Dec 22, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guillaume Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,804,245
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,753,963
- Issue date Aug 25, 2020
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with organic photodiodes and methods for forming the...
- Patent number 10,748,967
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 10,734,369
- Issue date Aug 4, 2020
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically testable integrated circuit packaging
- Patent number 10,699,970
- Issue date Jun 30, 2020
- pSemi Corporation
- Mark Moffat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device with cantilever structure
- Patent number 10,490,516
- Issue date Nov 26, 2019
- Intel Corporation
- John G. Meyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages that include a heat pipe for exhausting heat...
- Patent number 10,446,471
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- JaeHong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including plural semiconductor chips
- Patent number 10,403,605
- Issue date Sep 3, 2019
- Buffalo Inc.
- Yu Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 10,374,072
- Issue date Aug 6, 2019
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current sensor isolation
- Patent number 10,345,343
- Issue date Jul 9, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel light emitting LED substrate, package and bulb
- Patent number 10,269,719
- Issue date Apr 23, 2019
- Ge Tiehan
- F21 - LIGHTING
Information Patent Grant
Semiconductor device
- Patent number 10,170,394
- Issue date Jan 1, 2019
- Fuji Electric Co., Ltd.
- Kousuke Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically testable microwave integrated circuit packaging
- Patent number 10,109,537
- Issue date Oct 23, 2018
- pSemi Corporation
- Mark Moffat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,028,400
- Issue date Jul 17, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230026891
- Publication date Jan 26, 2023
- Mitsubishi Electric Corporation
- Yoshihiro TSUKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367414
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210398884
- Publication date Dec 23, 2021
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020606
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors with Organic Photodiodes and Methods for Forming the...
- Publication number 20200373357
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME
- Publication number 20200328199
- Publication date Oct 15, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kyohei MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20200006540
- Publication date Jan 2, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CURRENT SENSOR ISOLATION
- Publication number 20190277889
- Publication date Sep 12, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES THAT INCLUDE A HEAT PIPE FOR EXHAUSTING HEAT...
- Publication number 20190096786
- Publication date Mar 28, 2019
- Samsung Electronics Co., Ltd.
- JaeHong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Testable Microwave Integrated Circuit Packaging
- Publication number 20180211890
- Publication date Jul 26, 2018
- pSemi Corporation
- Mark Moffat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE
- Publication number 20180138133
- Publication date May 17, 2018
- Intel Corporation
- John G. Meyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180130772
- Publication date May 10, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20170309733
- Publication date Oct 26, 2017
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR AN ELECTRONIC DEVICE
- Publication number 20140264678
- Publication date Sep 18, 2014
- ALLEGRO MICROSYSTEMS, INC.
- SHIXI LOUIS LIU
- G01 - MEASURING TESTING
Information Patent Application
Methods and Devices for Fabricating and Assembling Printable Semico...
- Publication number 20140191236
- Publication date Jul 10, 2014
- The Board of Trustees of the University of IIIinois
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW PROFILE HEAT SPREADER AND METHODS
- Publication number 20140160673
- Publication date Jun 12, 2014
- Ioan Sauciuc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING MULTI-LAYER SUBSTRATE AND MULTI-LAYER SUBSTRATE
- Publication number 20140085843
- Publication date Mar 27, 2014
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20130320503
- Publication date Dec 5, 2013
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP ON FILM, AND METHOD OF MANUFACTURE THEREOF
- Publication number 20130134597
- Publication date May 30, 2013
- Funai Electric Co., Ltd.
- Hiroya Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE OF SURFACE-MOUNT ELECTRONIC COMPONENT PACKAGE, AND SURFACE-MOU...
- Publication number 20130098654
- Publication date Apr 25, 2013
- DAISHINKU CORPORATION
- Minoru Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE SUBSTRATE FOR CHIP ON FILM STRUCTURE OF LIQUID CRYSTAL PANEL
- Publication number 20130033669
- Publication date Feb 7, 2013
- Liangchan Liao
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR...
- Publication number 20120091572
- Publication date Apr 19, 2012
- Mitsubishi Electric Corporation
- Tsuneo Hamaguchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods and Devices for Fabricating and Assembling Printable Semico...
- Publication number 20110220890
- Publication date Sep 15, 2011
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION...
- Publication number 20110129966
- Publication date Jun 2, 2011
- Siliconware Precision Industries Co., Ltd.
- Yun-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Devices for Fabricating and Assembling Printable Semico...
- Publication number 20100072577
- Publication date Mar 25, 2010
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20090294803
- Publication date Dec 3, 2009
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20090127699
- Publication date May 21, 2009
- Hyun-Ok SHIN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with lead between a plurality of encapsulated...

Methods and devices for fabricating and assembling printable semico...

Semiconductor structure and manufacturing method thereof

Lead between a plurality of encapsulated MOSFETs

Method of making flexible semiconductor device with graphene tape

Semiconductor structure and manufacturing method thereof

Image sensors with organic photodiodes and methods for forming the...

Electrically testable integrated circuit packaging

Receiver optical module and process of assembling the same

Methods and devices for fabricating and assembling printable semico...

Semiconductor package including EMI shielding structure and method...

Housing for an electronic component, in particular a semiconductor...

Three-phase switching unit

Semiconductor structure and manufacturing method thereof

Current sensor isolation

Image sensors with organic photodiodes and methods for forming the...

Receiver optical module and process of assembling the same

Electrically testable integrated circuit packaging

Flexible semiconductor device with graphene tape

Packaged integrated circuit device with cantilever structure

Semiconductor packages that include a heat pipe for exhausting heat...

Semiconductor device including plural semiconductor chips

Methods and devices for fabricating and assembling printable semico...

Multi-surface edge pads for vertical mount packages and methods of...

Current sensor isolation

Multilevel light emitting LED substrate, package and bulb

Semiconductor device

Semiconductor arrangement, semiconductor system and method of formi...

Electrically testable microwave integrated circuit packaging

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Image Sensors with Organic Photodiodes and Methods for Forming the...

RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

CURRENT SENSOR ISOLATION

SEMICONDUCTOR PACKAGES THAT INCLUDE A HEAT PIPE FOR EXHAUSTING HEAT...

Electrically Testable Microwave Integrated Circuit Packaging

PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

PACKAGING FOR AN ELECTRONIC DEVICE

Methods and Devices for Fabricating and Assembling Printable Semico...

LOW PROFILE HEAT SPREADER AND METHODS

METHOD FOR PRODUCING MULTI-LAYER SUBSTRATE AND MULTI-LAYER SUBSTRATE

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

CHIP ON FILM, AND METHOD OF MANUFACTURE THEREOF

BASE OF SURFACE-MOUNT ELECTRONIC COMPONENT PACKAGE, AND SURFACE-MOU...

TAPE SUBSTRATE FOR CHIP ON FILM STRUCTURE OF LIQUID CRYSTAL PANEL

SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR...

Methods and Devices for Fabricating and Assembling Printable Semico...

SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION...

Methods and Devices for Fabricating and Assembling Printable Semico...

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE AND SEMICONDUCTOR PACKAGE