Top view

Industry

CPC
H01L2924/15157

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15157Top view

Industries

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated emissive element for fluidic assembly
- Patent number 10,777,714
- Issue date Sep 15, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating emissive elements for fluidic assembly
- Patent number 10,749,083
- Issue date Aug 18, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated fluid assembly emissive elements
- Patent number 10,516,084
- Issue date Dec 24, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,881,900
- Issue date Jan 30, 2018
- Rohm Co., Ltd.
- Hirofumi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die power semiconductor device
- Patent number 9,613,941
- Issue date Apr 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,559,028
- Issue date Jan 31, 2017
- Rohm Co., Ltd.
- Hirofumi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier with dual-sided chip access and a method for testing a...
- Patent number 9,412,691
- Issue date Aug 9, 2016
- GLOBALFOUNDRIES Inc.
- Heather M. Truax
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component mounting structure
- Patent number 9,408,309
- Issue date Aug 2, 2016
- Olympus Corporation
- Takanori Sekido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having member which functions as ground conductor...
- Patent number 8,829,362
- Issue date Sep 9, 2014
- Fujitsu Limited
- Satoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,705,248
- Issue date Apr 22, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device and manufacturing method the...
- Patent number 8,659,127
- Issue date Feb 25, 2014
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate structure with electronic component embedded th...
- Patent number 8,436,463
- Issue date May 7, 2013
- Unimicron Technology Corp.
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,320,135
- Issue date Nov 27, 2012
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having a jumper chip and method of fab...
- Patent number 8,222,726
- Issue date Jul 17, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device, and method of manufacturing the same
- Patent number 8,178,957
- Issue date May 15, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,119,929
- Issue date Feb 21, 2012
- Shinko Electric Industries Co., Ltd.
- Akio Horiuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silicon substrate for package
- Patent number 8,106,484
- Issue date Jan 31, 2012
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,093,696
- Issue date Jan 10, 2012
- Qimonda AG
- Kimyung Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon substrate and chip package structure with silicon base havi...
- Patent number 8,018,032
- Issue date Sep 13, 2011
- Unimicron Technology Corp.
- Chih-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon substrate for package
- Patent number 7,989,927
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising a functional device and a resonator and method...
- Patent number 7,967,204
- Issue date Jun 28, 2011
- Alien Technology Corporation
- Mark A. Hadley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer printed circuit board
- Patent number 7,957,154
- Issue date Jun 7, 2011
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed circuit board
- Patent number 7,929,313
- Issue date Apr 19, 2011
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3-dimensional substrate for embodying multi-packages and method of...
- Patent number 7,880,093
- Issue date Feb 1, 2011
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated process condition sensing wafer and data analysis system
- Patent number 7,855,549
- Issue date Dec 21, 2010
- KLA-Tencor Corporation
- Wayne Glenn Renken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making light emitting diodes
- Patent number 7,745,241
- Issue date Jun 29, 2010
- Foxconn Technology Co., Ltd.
- Chia-Shou Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Seamless Interconnect Thresholds using Dielectric Fluid Channels
- Publication number 20220238401
- Publication date Jul 28, 2022
- SCIPERIO, INC.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170098625
- Publication date Apr 6, 2017
- Rohm Co., Ltd.
- Hirofumi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER WITH DUAL-SIDED CHIP ACCESS AND A METHOD FOR TESTING A...
- Publication number 20160163631
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Heather M. Truax
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20140367156
- Publication date Dec 18, 2014
- OLYMPUS CORPORATION
- Takanori Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130081867
- Publication date Apr 4, 2013
- Fujitsu Limited
- Satoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20130033837
- Publication date Feb 7, 2013
- Sotaro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE...
- Publication number 20120313226
- Publication date Dec 13, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20110233749
- Publication date Sep 29, 2011
- Hsiao-Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SUBSTRATE FOR PACKAGE
- Publication number 20110227218
- Publication date Sep 22, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20110176284
- Publication date Jul 21, 2011
- IBIDEN CO., LTD.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACK-TYPE SOLID-STATE DRIVE
- Publication number 20110089553
- Publication date Apr 21, 2011
- STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed wiring board, printed IC board having the printed wiring bo...
- Publication number 20100226110
- Publication date Sep 9, 2010
- DENSO CORPORATION
- Takuya Kouya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100207218
- Publication date Aug 19, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PROCESS, AND SILICON SUBSTRATE AND CHIP PACKAGE STRUC...
- Publication number 20100164092
- Publication date Jul 1, 2010
- Unimicron Technology Corp.
- Chih-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20100159647
- Publication date Jun 24, 2010
- IBIDEN CO., LTD.
- Sotaro ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING...
- Publication number 20100103623
- Publication date Apr 29, 2010
- Changsoo Kwank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for fabricating self-assembling microstructures
- Publication number 20100075463
- Publication date Mar 25, 2010
- The Regents of the University of California
- John Stephen Smith
- G02 - OPTICS
Information Patent Application
METHOD OF MAKING LIGHT EMITTING DIODES
- Publication number 20090305443
- Publication date Dec 10, 2009
- FOXCONN TECHNOLOGY CO., LTD.
- CHIA-SHOU CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090283899
- Publication date Nov 19, 2009
- Kimyung Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090126981
- Publication date May 21, 2009
- Shinko Electric Industries Co., Ltd.
- Akio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY COMPRISING A FUNCTIONAL DEVICE AND A RESONATOR AND METHOD...
- Publication number 20090109002
- Publication date Apr 30, 2009
- Mark A. Hadley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON SUBSTRATE FOR PACKAGE
- Publication number 20090108411
- Publication date Apr 30, 2009
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BAND TUNABLE RESONANT CIRCUIT
- Publication number 20090079524
- Publication date Mar 26, 2009
- BITWAVE SEMICONDUCTOR, INC.
- Russell J. Cyr
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND ME...
- Publication number 20090056113
- Publication date Mar 5, 2009
- Gordon S.W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Packaging substrate structure with electronic component embedded th...
- Publication number 20090057873
- Publication date Mar 5, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect substrate, semiconductor device, methods of manufactur...
- Publication number 20080293239
- Publication date Nov 27, 2008
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer ceramic substrate
- Publication number 20080283281
- Publication date Nov 20, 2008
- TDK Corporation
- Kenji Endou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES
- Publication number 20080182362
- Publication date Jul 31, 2008
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL SUBSTRATE FOR EMBODYING MULTI-PACKAGES AND METHOD OF...
- Publication number 20080081209
- Publication date Apr 3, 2008
- Woong Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Encapsulated light emitting diodes for selective fluidic assembly

Chip assembly

Encapsulated emissive element for fluidic assembly

Method for encapsulating emissive elements for fluidic assembly

Chip assembly

Encapsulated fluid assembly emissive elements

Semiconductor device

Method of forming a chip assembly with a die attach liquid

Exposed die power semiconductor device

Semiconductor device

Chip carrier with dual-sided chip access and a method for testing a...

Electronic component mounting structure

Electronic device having member which functions as ground conductor...

Multilayer printed circuit board

Wiring substrate, semiconductor device and manufacturing method the...

Packaging substrate structure with electronic component embedded th...

Multilayer printed circuit board

Semiconductor device package having a jumper chip and method of fab...

Electronic component device, and method of manufacturing the same

Wiring board and method for manufacturing the same

Silicon substrate for package

Semiconductor device

Silicon substrate and chip package structure with silicon base havi...

Silicon substrate for package

Assembly comprising a functional device and a resonator and method...

Multilayer printed circuit board

Method of manufacturing multilayer printed circuit board

3-dimensional substrate for embodying multi-packages and method of...

Integrated process condition sensing wafer and data analysis system

Method of making light emitting diodes

Patents Applicationslast 30 patents

Seamless Interconnect Thresholds using Dielectric Fluid Channels

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

SEMICONDUCTOR DEVICE

CHIP CARRIER WITH DUAL-SIDED CHIP ACCESS AND A METHOD FOR TESTING A...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

ELECTRONIC DEVICE

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

SILICON SUBSTRATE FOR PACKAGE

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

STACK-TYPE SOLID-STATE DRIVE

Printed wiring board, printed IC board having the printed wiring bo...

ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PROCESS, AND SILICON SUBSTRATE AND CHIP PACKAGE STRUC...

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING...

Method and apparatus for fabricating self-assembling microstructures

METHOD OF MAKING LIGHT EMITTING DIODES

Semiconductor Device

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ASSEMBLY COMPRISING A FUNCTIONAL DEVICE AND A RESONATOR AND METHOD...

SILICON SUBSTRATE FOR PACKAGE

MULTI-BAND TUNABLE RESONANT CIRCUIT

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND ME...

Packaging substrate structure with electronic component embedded th...

Interconnect substrate, semiconductor device, methods of manufactur...

Multilayer ceramic substrate

METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES

3-DIMENSIONAL SUBSTRATE FOR EMBODYING MULTI-PACKAGES AND METHOD OF...