Transferring metal or conductive material other than a circuit pattern

Industry

CPC
H05K2203/0338

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0338Transferring metal or conductive material other than a circuit pattern

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for printing solder paste and other viscous materials at hi...
- Patent number 11,697,166
- Issue date Jul 11, 2023
- IO Tech Group Ltd.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for printing solder paste and other viscous materials at hi...
- Patent number 11,446,750
- Issue date Sep 20, 2022
- IO TECH GROUP LTD.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,268,203
- Issue date Mar 8, 2022
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,162,182
- Issue date Nov 2, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Three-dimensional packaging structure and packaging method of power...
- Patent number 10,943,845
- Issue date Mar 9, 2021
- Huazhong University of Science & Technology
- Cai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management module and method of manufacture
- Patent number 10,475,568
- Issue date Nov 12, 2019
- L. Pierre de Rochemont
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Three-dimensional packaging structure and packaging method of power...
- Patent number 10,354,937
- Issue date Jul 16, 2019
- Huazhong University of Science & Technology
- Cai Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder application stamp for applying solder on contact locations p...
- Patent number 10,237,982
- Issue date Mar 19, 2019
- ENDRESS+HAUSER SE+CO.KG
- Christoph Hippin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components and method of manufacture
- Patent number 9,905,928
- Issue date Feb 27, 2018
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solder precoating method and workpiece for electronic equipment
- Patent number 9,821,397
- Issue date Nov 21, 2017
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bellows interconnect
- Patent number 9,801,277
- Issue date Oct 24, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano-copper via fill for enhanced thermal conductivity of plated th...
- Patent number 9,736,947
- Issue date Aug 15, 2017
- Multek Technologies, Ltd.
- Mark Bergman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,699,920
- Issue date Jul 4, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable electronic device contact puck alignment
- Patent number 9,591,766
- Issue date Mar 7, 2017
- Motorola Mobility LLC
- Michael J Lombardi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring board and semiconductor device
- Patent number 9,155,195
- Issue date Oct 6, 2015
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,040,832
- Issue date May 26, 2015
- Shinko Electric Industries Co., Ltd.
- Yuichiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of solder transfer substrate, solder precoatin...
- Patent number 9,027,822
- Issue date May 12, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-random array anisotropic conductive film (ACF) and manufacturin...
- Patent number 8,802,214
- Issue date Aug 12, 2014
- Trillion Science, Inc.
- Rong-Chang Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carbon nanotube contact structures for use with semiconductor dies...
- Patent number 8,756,802
- Issue date Jun 24, 2014
- FormFactor, Inc.
- John K. Gritters
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for forming mirror-reflecting film in optical wiring board,...
- Patent number 8,744,227
- Issue date Jun 3, 2014
- Panasonic Corporation
- Tohru Nakashiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture method for semiconductor device with bristled conductiv...
- Patent number 8,735,274
- Issue date May 27, 2014
- Fujitsu Limited
- Masataka Mizukoshi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrical components and method of manufacture
- Patent number 8,715,839
- Issue date May 6, 2014
- L. Pierre de Rochemont
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Solder bump formation on a circuit board using a transfer sheet
- Patent number 8,701,973
- Issue date Apr 22, 2014
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for securing electronic components to a substrate
- Patent number 8,662,377
- Issue date Mar 4, 2014
- Semikron Elektronik GmbH & Co., KG
- Gerhard Palm
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo-compression bonded electrical interconnect structure and method
- Patent number 8,541,291
- Issue date Sep 24, 2013
- Ultratech, Inc.
- Bruce K. Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating wiring board and method of fabricating semico...
- Patent number 8,455,770
- Issue date Jun 4, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...
- Publication number 20210337674
- Publication date Oct 28, 2021
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
LOCALIZED REWORK USING LIQUID MEDIA SOLDERING
- Publication number 20210120712
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378025
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378024
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20190067199
- Publication date Feb 28, 2019
- Shinko Electric Industries Co., Ltd.
- Daisuke Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER...
- Publication number 20190067151
- Publication date Feb 28, 2019
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Cai CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PORTABLE ELECTRONIC DEVICE CONTACT PUCK ALIGNMENT
- Publication number 20160249466
- Publication date Aug 25, 2016
- Michael J. Lombardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150163908
- Publication date Jun 11, 2015
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURIN...
- Publication number 20140312501
- Publication date Oct 23, 2014
- Trillion Science Inc.
- Rong-Chang Liang
- B32 - LAYERED PRODUCTS
Information Patent Application
Thin Film Deposition of Materials by External Induced Release from...
- Publication number 20140242747
- Publication date Aug 28, 2014
- Zvi Yaniv
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20130235543
- Publication date Sep 12, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...
- Publication number 20130181041
- Publication date Jul 18, 2013
- PANASONIC CORPORATION
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Management Module and Method of Manufacture
- Publication number 20130175664
- Publication date Jul 11, 2013
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Application
Carbon Nanotube Contact Structures For Use With Semiconductor Dies...
- Publication number 20130140057
- Publication date Jun 6, 2013
- FormFactor, Inc.
- John K. Gritters
- B82 - NANO-TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130126215
- Publication date May 23, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE-INCORPORATED CAPACITOR, CAPACITOR-INCORPORATING SUBSTRATE...
- Publication number 20130120902
- Publication date May 16, 2013
- SANYO ELECTRIC CO., LTD.
- Hitoshi Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120247814
- Publication date Oct 4, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FULL-FIELD SOLDER COVERAGE
- Publication number 20120193833
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Russell A. Budd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20120111728
- Publication date May 10, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
- Publication number 20110297433
- Publication date Dec 8, 2011
- SENJU METAL INDUSTRY CO., LTD.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING WIRING BOARD AND METHOD OF FABRICATING SEMICO...
- Publication number 20110286189
- Publication date Nov 24, 2011
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR ELECTRICAL CIRCUIT REPAIR
- Publication number 20110278269
- Publication date Nov 17, 2011
- ORBOTECH LTD.
- Uri Gold
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with buried circuit pattern
- Publication number 20110259627
- Publication date Oct 27, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hoe-Ku Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING MIRROR-REFLECTING FILM IN OPTICAL WIRING BOARD,...
- Publication number 20110243495
- Publication date Oct 6, 2011
- PANASONIC ELECTRIC WORKS CO., LTD.,
- Tohru Nakashiba
- G02 - OPTICS
Information Patent Application
THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
- Publication number 20110239458
- Publication date Oct 6, 2011
- International Business Machines Corporation
- Bruce K. Furman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FILL-HEAD FOR FULL-FIELD SOLDER COVERAGE WITH A ROTATABLE MEMBER
- Publication number 20110203762
- Publication date Aug 25, 2011
- International Business Machines Corp.
- Russell A. BUDD
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUAL METHOD FOR REBALLING USING A SOLDER PREFORM
- Publication number 20110132972
- Publication date Jun 9, 2011
- BEST, INC.
- Robert P. Wettermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bumping Electronic Components Using Transfer Substrates
- Publication number 20110092066
- Publication date Apr 21, 2011
- John Mackay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING T...
- Publication number 20110048786
- Publication date Mar 3, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Transferring metal or conductive material other than a circuit pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for printing solder paste and other viscous materials at hi...

Systems for printing solder paste and other viscous materials at hi...

Localized rework using liquid media soldering

Circuit board

Tin or tin alloy plating solution

Modulated inductance module

Tin or tin alloy plating solution

Three-dimensional packaging structure and packaging method of power...

Power management module and method of manufacture

Three-dimensional packaging structure and packaging method of power...

Solder application stamp for applying solder on contact locations p...

Conductive connecting member and manufacturing method of same

Electrical components and method of manufacture

Solder precoating method and workpiece for electronic equipment

Bellows interconnect

Nano-copper via fill for enhanced thermal conductivity of plated th...

Printed wiring board

Portable electronic device contact puck alignment

Wiring board and semiconductor device

Wiring substrate and method of manufacturing the same

Manufacturing method of solder transfer substrate, solder precoatin...

Non-random array anisotropic conductive film (ACF) and manufacturin...

Carbon nanotube contact structures for use with semiconductor dies...

Method for forming mirror-reflecting film in optical wiring board,...

Manufacture method for semiconductor device with bristled conductiv...

Electrical components and method of manufacture

Solder bump formation on a circuit board using a transfer sheet

Method for securing electronic components to a substrate

Thermo-compression bonded electrical interconnect structure and method

Method of fabricating wiring board and method of fabricating semico...

Patents Applicationslast 30 patents

ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...

LOCALIZED REWORK USING LIQUID MEDIA SOLDERING

TIN OR TIN ALLOY PLATING SOLUTION

TIN OR TIN ALLOY PLATING SOLUTION

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

WIRING BOARD AND ELECTRONIC DEVICE

THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER...

PORTABLE ELECTRONIC DEVICE CONTACT PUCK ALIGNMENT

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURIN...

Thin Film Deposition of Materials by External Induced Release from...

WIRING BOARD AND SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...

Power Management Module and Method of Manufacture

Carbon Nanotube Contact Structures For Use With Semiconductor Dies...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE-INCORPORATED CAPACITOR, CAPACITOR-INCORPORATING SUBSTRATE...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FULL-FIELD SOLDER COVERAGE

METHOD OF MANUFACTURING CIRCUIT BOARD

SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET

METHOD OF FABRICATING WIRING BOARD AND METHOD OF FABRICATING SEMICO...

METHOD AND SYSTEM FOR ELECTRICAL CIRCUIT REPAIR

Circuit board with buried circuit pattern

METHOD FOR FORMING MIRROR-REFLECTING FILM IN OPTICAL WIRING BOARD,...

THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD

FILL-HEAD FOR FULL-FIELD SOLDER COVERAGE WITH A ROTATABLE MEMBER

MANUAL METHOD FOR REBALLING USING A SOLDER PREFORM

Bumping Electronic Components Using Transfer Substrates

PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING T...