Transient conditions

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CPC
H01L2224/85096

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85096Transient conditions

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Patents Grantslast 30 patents

Information Patent Grant
Method of soldering semiconductor substrate on supporting plate
- Patent number 4,972,988
- Issue date Nov 27, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mituo Ohdate
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Soldering Method, Soldering Apparatus and Method for Manufacturing...
- Publication number 20090218386
- Publication date Sep 3, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR