Transient conditions

Industry

CPC
H01L2224/81093

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81093Transient conditions

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,796,958
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,777,454
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,651,086
- Issue date May 12, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step direct bonding processes and tools for performing the same
- Patent number 9,521,795
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,016,342
- Issue date Apr 28, 2015
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 8,563,396
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component, and electronic compo...
- Patent number 8,531,028
- Issue date Sep 10, 2013
- Sumitomo Bakelite Co., Ltd.
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing electronic device and electronic device
- Patent number 8,389,328
- Issue date Mar 5, 2013
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20180374751
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180337091
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180315655
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20130324641
- Publication date Dec 5, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenzou MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120247664
- Publication date Oct 4, 2012
- Kazuhiko KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20120193752
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20120061820
- Publication date Mar 15, 2012
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20110221075
- Publication date Sep 15, 2011
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Transient conditions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

Method and apparatus for chip-to-wafer integration

Two-step direct bonding processes and tools for performing the same

Bonding apparatus and bonding method

3D integration method using SOI substrates and structures produced...

Method for manufacturing electronic component, and electronic compo...

Method of manufacturing electronic device and electronic device

Patents Applicationslast 30 patents

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

Two-Step Direct Bonding Processes and Tools for Performing the Same

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

BONDING APPARATUS AND BONDING METHOD

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE