Transition metals

Industry

CPC
H01L2924/01103

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01103Transition metals

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connection structure and electronic component
- Patent number 10,109,609
- Issue date Oct 23, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,355,952
- Issue date May 31, 2016
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless semiconductor package with optical inspection feature
- Patent number 9,287,238
- Issue date Mar 15, 2016
- Infineon Technologies AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,093,313
- Issue date Jul 28, 2015
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 8,835,217
- Issue date Sep 16, 2014
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,492,894
- Issue date Jul 23, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead-Free Solder Alloy
- Publication number 20160074971
- Publication date Mar 17, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Ken Tachibana
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Connection Structure and Electronic Component
- Publication number 20150200178
- Publication date Jul 16, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Semiconductor Package with Optical Inspection Feature
- Publication number 20150155229
- Publication date Jun 4, 2015
- INFINEON TECHNOLOGIES AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150008578
- Publication date Jan 8, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20120161330
- Publication date Jun 28, 2012
- Intel Corporation
- Mark S. Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS

Transition metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and electronic component

Device packaging with substrates having embedded lines and metal de...

Leadless semiconductor package with optical inspection feature

Device packaging with substrates having embedded lines and metal de...

Bump, method for forming the bump, and method for mounting substrat...

Device packaging with substrates having embedded lines and metal de...

Bump, method for forming the bump, and method for mounting substrat...

Patents Applicationslast 30 patents

Lead-Free Solder Alloy

Connection Structure and Electronic Component

Leadless Semiconductor Package with Optical Inspection Feature

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...