Translational mechanism

Industry

CPC
H01L2224/78804

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78804Translational mechanism

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball bond attachment for a semiconductor die
- Patent number 10,692,835
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE
- Publication number 20190378814
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES
- Publication number 20170301644
- Publication date Oct 19, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20160163673
- Publication date Jun 9, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20140138426
- Publication date May 22, 2014
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS

Translational mechanism

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding method and wire bonding device

Clamping system, wire bonding machine, and method for bonding wires

Ball bond attachment for a semiconductor die

Bonding apparatus and method of estimating position of landing poin...

Patents Applicationslast 30 patents

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

WIRE BONDING APPARATUS

WIRE BONDING METHOD AND WIRE BONDING DEVICE

BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE

CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES

WIRE BONDING APPARATUS AND BONDING METHOD

WIRE BONDING APPARATUS AND BONDING METHOD