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Translational mechanism

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  • CPC
  • H01L2224/78824
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78824Translational mechanism
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 12,261,148
    • Issue date Mar 25, 2025
    • Shinkawa Ltd.
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus and method for manufacturing semiconductor d...
    • Patent number 12,107,070
    • Issue date Oct 1, 2024
    • Shinkawa Ltd.
    • Hiroaki Yoshino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 12,057,427
    • Issue date Aug 6, 2024
    • Shinkawa Ltd.
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 11,961,819
    • Issue date Apr 16, 2024
    • Shinkawa Ltd.
    • Naoki Sekine
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 11,908,827
    • Issue date Feb 20, 2024
    • Shinkawa Ltd.
    • Naoki Sekine
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Full-automatic deep access ball bonding head device
    • Patent number 11,437,343
    • Issue date Sep 6, 2022
    • ZHEJIANG RUIQUN TECHNOLOGY CO., LTD.
    • Wen Chen
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Device and method for positioning first object in relation to secon...
    • Patent number 11,139,193
    • Issue date Oct 5, 2021
    • Shinkawa Ltd.
    • Tetsuya Utano
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Wire bonding technique for integrated circuit board connections
    • Patent number 10,600,756
    • Issue date Mar 24, 2020
    • United States of America, as represented by the Secretary of the Navy
    • Evan A. Aanerud
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Mounting apparatus
    • Patent number 10,340,163
    • Issue date Jul 2, 2019
    • Shinkawa Ltd.
    • Kohei Seyama
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Bonding device
    • Patent number 10,262,969
    • Issue date Apr 16, 2019
    • Kaijo Corporation
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing light-emitting device
    • Patent number 10,181,452
    • Issue date Jan 15, 2019
    • Nichia Corporation
    • Yuji Kojima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding device
    • Patent number 9,865,562
    • Issue date Jan 9, 2018
    • Kaijo Corporation
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents