Membership
Tour
Register
Log in
Translational movements
Follow
Industry
CPC
H01L2224/8016
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/8016
Translational movements
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Device and method for the alignment of substrates
Patent number
12,199,062
Issue date
Jan 14, 2025
EV Group E. Thallner GmbH
Dominik Zinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding semiconductor chips to a landing wafer
Patent number
10,797,016
Issue date
Oct 6, 2020
Imec VZW
Vikas Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnet assisted alignment method for wafer bonding and wafer level...
Patent number
9,012,265
Issue date
Apr 21, 2015
Ge Yi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
Publication number
20230343743
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Jung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
Publication number
20230275062
Publication date
Aug 31, 2023
TOKYO ELECTRON LIMITED
Toshifumi Inamasu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
Publication number
20230207513
Publication date
Jun 29, 2023
EV GROUP E. THALLNER GMBH
Dominik Zinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF
Publication number
20150155210
Publication date
Jun 4, 2015
Samsung Electronics Co., Ltd.
Byung Joon LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...
Publication number
20130252375
Publication date
Sep 26, 2013
Ge Yi
H01 - BASIC ELECTRIC ELEMENTS