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H01L2224/8116

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8116Translational movements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit pin positioning structure, fabrication method of soldered c...
- Patent number 10,679,961
- Issue date Jun 9, 2020
- Tarng Yu Enterprise Co., Ltd.
- Tsung-Chi Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pick-and-place tool for packaging process
- Patent number 9,966,357
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor manu...
- Patent number 9,448,065
- Issue date Sep 20, 2016
- Kabushiki Kaisha Toshiba
- Shinya Fukayama
- G01 - MEASURING TESTING
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnet assisted alignment method for wafer bonding and wafer level...
- Patent number 9,012,265
- Issue date Apr 21, 2015
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems involving soldering
- Patent number 8,939,346
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MAN...
- Publication number 20230111183
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Duhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20180366434
- Publication date Dec 20, 2018
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PIN POSITIONING STRUCTURE, FABRICATION METHOD OF SOLDERED C...
- Publication number 20180082974
- Publication date Mar 22, 2018
- Tarng Yu Enterprise co.,ltd
- TSUNG-CHI CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...
- Publication number 20160079102
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Shinya FUKAYAMA
- G01 - MEASURING TESTING
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20150333033
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20140030849
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...
- Publication number 20130252375
- Publication date Sep 26, 2013
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems Involving Soldering
- Publication number 20120205424
- Publication date Aug 16, 2012
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Translational movements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bond tips and related apparatus and methods

High speed handling of ultra-small chips by selective laser bonding...

Thermocompression bond tips and related apparatus and methods

Circuit pin positioning structure, fabrication method of soldered c...

High speed handling of ultra-small chips by selective laser bonding...

Apparatus and method for manufacturing semiconductor device

Pick-and-place tool for packaging process

Manufacturing method of semiconductor device and semiconductor manu...

Method for device packaging

Magnet assisted alignment method for wafer bonding and wafer level...

Methods and systems involving soldering

Patents Applicationslast 30 patents

WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MAN...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

CIRCUIT PIN POSITIONING STRUCTURE, FABRICATION METHOD OF SOLDERED C...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...

Pick-and-Place Tool for Packaging Process

Pick-and-Place Tool for Packaging Process

Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...

Methods and Systems Involving Soldering

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...