Translational movements

Industry

CPC
H01L2224/8118

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8118Translational movements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mounting apparatus and parallelism detection method in mounting app...
- Patent number 12,018,936
- Issue date Jun 25, 2024
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,692,783
- Issue date Jun 23, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,472,527
- Issue date Oct 18, 2016
- Fujitsu Limited
- Toshiya Akamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bonding semiconductor chips
- Patent number 9,431,365
- Issue date Aug 30, 2016
- Samsung Electronics Co., Ltd.
- Seung-dae Seok
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20230268313
- Publication date Aug 24, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230187285
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- SANG-WON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND PARALLELISM DETECTION METHOD IN MOUNTING APP...
- Publication number 20220412733
- Publication date Dec 29, 2022
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180090395
- Publication date Mar 29, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR POSITIONING USING NEAR FIELD TRANSDUCERS, PAR...
- Publication number 20170365497
- Publication date Dec 21, 2017
- Alan S. Edelstein
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20160079199
- Publication date Mar 17, 2016
- Seung-dae SEOK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Translational movements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting apparatus and parallelism detection method in mounting app...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Apparatus and method for manufacturing semiconductor device

Die bonding with liquid phase solder

Semiconductor device and manufacturing method thereof

Apparatus for bonding semiconductor chips

Method for device packaging

Patents Applicationslast 30 patents

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

MOUNTING APPARATUS AND PARALLELISM DETECTION METHOD IN MOUNTING APP...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

METHOD AND SYSTEM FOR POSITIONING USING NEAR FIELD TRANSDUCERS, PAR...

APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...