Treating individual holes or single row of holes

Industry

CPC
H05K2203/0763

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0763Treating individual holes or single row of holes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Maintenance board
- Patent number 11,432,443
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Takeshi Sakurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon-based direct plating process
- Patent number 10,986,738
- Issue date Apr 20, 2021
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Etching device and method for manufacturing printed circuit board u...
- Patent number 8,685,202
- Issue date Apr 1, 2014
- Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd
- Yao-Wen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of coating flux
- Patent number 8,544,713
- Issue date Oct 1, 2013
- Senju Metal Industry Co., Ltd.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board fabrication method
- Patent number 8,402,648
- Issue date Mar 26, 2013
- Fujitsu Limited
- Daita Tsubamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized jet soldering device and partial jet soldering method
- Patent number 8,403,199
- Issue date Mar 26, 2013
- Senju Metal Industry Co., Ltd.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for selective soldering
- Patent number 8,328,069
- Issue date Dec 11, 2012
- Linde Atkiengesellschaft
- Hans Isler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Point flow soldering apparatus
- Patent number 8,302,835
- Issue date Nov 6, 2012
- Senju Metal Industry Co., Ltd.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solid vias in a printed circuit board
- Patent number 7,987,587
- Issue date Aug 2, 2011
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly remanufacturing system and method
- Patent number 7,681,778
- Issue date Mar 23, 2010
- Caterpillar Inc.
- Paul C Gottshall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for selectively filling apertures in a substrate to form co...
- Patent number 7,560,371
- Issue date Jul 14, 2009
- Micron Technology, Inc.
- Ross S. Dando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting terminal on printed board, terminal mounted prin...
- Patent number 7,311,241
- Issue date Dec 25, 2007
- SUMITOMO WIRING SYSTEMS, LTD.
- Shunji Taga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for local application of solder to preselected areas on a pr...
- Patent number 6,915,941
- Issue date Jul 12, 2005
- Senju Metal Industry Co., Ltd.
- Akira Takaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for soldering through-hole components on circu...
- Patent number 6,305,596
- Issue date Oct 23, 2001
- Asustek Computer Inc.
- Shui-Town Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via fill compositions for direct attach of devices and methods of a...
- Patent number 6,134,772
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Roy Lynn Arldt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Soldering device
- Patent number 6,126,060
- Issue date Oct 3, 2000
- Samsung Electronics Co., Ltd.
- Young-Zoon Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for soldering
- Patent number 6,123,251
- Issue date Sep 26, 2000
- Unisys Corporation
- Sean M. McClain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via fill compositions for direct attach of devices and method for a...
- Patent number 6,106,891
- Issue date Aug 22, 2000
- International Business Machines Corporation
- Joseph Duane Kulesza
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for applying curable fill compositon to apertures in a subst...
- Patent number 5,887,345
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Joseph Duane Kulesza
- B32 - LAYERED PRODUCTS
Information Patent Grant
Inert atmosphere soldering apparatus
- Patent number 5,860,582
- Issue date Jan 19, 1999
- William Sund
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via fill compositions for direct attach of devices and methods for...
- Patent number 5,766,670
- Issue date Jun 16, 1998
- Roy Lynn Arldt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Inert atmosphere soldering apparatus
- Patent number 5,711,473
- Issue date Jan 27, 1998
- William Sund
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming contacts through bores in multi-layer circuit boards
- Patent number 5,630,272
- Issue date May 20, 1997
- LPKF CAD/CAM Systeme GmbH
- Stephan Wenke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via fill compositions for direct attach of devices and methods for...
- Patent number 5,571,593
- Issue date Nov 5, 1996
- International Business Machines Corporation
- Roy L. Arldt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board with aligned connections and method of making...
- Patent number 5,450,290
- Issue date Sep 12, 1995
- International Business Machines Corporation
- Christina M. Boyko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packing filler into through-holes in a printed circuit board
- Patent number 5,268,194
- Issue date Dec 7, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming filled holes in multi-layer integrated circuit p...
- Patent number 5,242,641
- Issue date Sep 7, 1993
- Pacific Trinetics Corporation
- James W. Horner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of forming through-holes in printed wiring board
- Patent number 5,191,709
- Issue date Mar 9, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit writer materials
- Patent number 5,156,772
- Issue date Oct 20, 1992
- Ariel Electronics, Inc.
- G. Graham Allan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of filling conductive material into through holes of printed...
- Patent number 5,133,120
- Issue date Jul 28, 1992
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING
- Publication number 20230262904
- Publication date Aug 17, 2023
- Peters Research GmbH & Co. Kommanditgesellschaft
- Ralf SCHWARTZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carbon-Based Direct Plating Process
- Publication number 20210204412
- Publication date Jul 1, 2021
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Carbon-Based Direct Plating Process
- Publication number 20190350089
- Publication date Nov 14, 2019
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MAINTENANCE BOARD
- Publication number 20190335630
- Publication date Oct 31, 2019
- FUJI CORPORATION
- Takeshi SAKURAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER POT
- Publication number 20120091188
- Publication date Apr 19, 2012
- ROBERT BOSCH GmbH
- Bassem Elhage
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD U...
- Publication number 20120031873
- Publication date Feb 9, 2012
- FOXCONN ADVANCED TECHNOLOGY INC.
- YAO-WEN BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOCALIZED JET SOLDERING DEVICE AND PARTIAL JET SOLDERING METHOD
- Publication number 20120006886
- Publication date Jan 12, 2012
- SENJU METAL INDUSTRY CO., LTD.
- Issaku SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POINT FLOW SOLDERING APPARATUS
- Publication number 20110284619
- Publication date Nov 24, 2011
- SENJU METAL INDUSTRY CO., LTD.
- Issaku SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DISMOUNTING ELECTRONIC DEVICE
- Publication number 20100223775
- Publication date Sep 9, 2010
- FUJITSU LIMITED
- Osamu HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF COATING FLUX
- Publication number 20100163606
- Publication date Jul 1, 2010
- SENJU METAL INDUSTRY CO., LTD.
- Issaku SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR SELECTIVE SOLDERING
- Publication number 20100059575
- Publication date Mar 11, 2010
- Hans Isler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FABRICATION METHOD, PRINTED CIRCUIT BOARD OBT...
- Publication number 20090294169
- Publication date Dec 3, 2009
- FUJITSU LIMITED
- Daita TSUBAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Forming Solid Vias in a Printed Circuit Board
- Publication number 20090223710
- Publication date Sep 10, 2009
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY REMANUFACTURING SYSTEM AND METHOD
- Publication number 20090127321
- Publication date May 21, 2009
- Caterpillar Inc.
- Paul C. Gottshall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and systems for selectively filling apertures in a substrat...
- Publication number 20080057691
- Publication date Mar 6, 2008
- Ross S. Dando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of mounting terminal on printed board, terminal mounted prin...
- Publication number 20060040517
- Publication date Feb 23, 2006
- SUMITOMO WIRING SYSTEMS, LTD.
- Shunji Taga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for local application of solder to preselected areas on a pr...
- Publication number 20030066866
- Publication date Apr 10, 2003
- Akira Takaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Treating individual holes or single row of holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Maintenance board

Carbon-based direct plating process

Etching device and method for manufacturing printed circuit board u...

Apparatus and method of coating flux

Printed circuit board fabrication method

Localized jet soldering device and partial jet soldering method

Device and method for selective soldering

Point flow soldering apparatus

Method of forming solid vias in a printed circuit board

Electronic assembly remanufacturing system and method

Methods for selectively filling apertures in a substrate to form co...

Method of mounting terminal on printed board, terminal mounted prin...

Method for local application of solder to preselected areas on a pr...

Apparatus and method for soldering through-hole components on circu...

Via fill compositions for direct attach of devices and methods of a...

Soldering device

Apparatus and method for soldering

Via fill compositions for direct attach of devices and method for a...

Method for applying curable fill compositon to apertures in a subst...

Inert atmosphere soldering apparatus

Via fill compositions for direct attach of devices and methods for...

Inert atmosphere soldering apparatus

Method of forming contacts through bores in multi-layer circuit boards

Via fill compositions for direct attach of devices and methods for...

Printed circuit board with aligned connections and method of making...

Method of packing filler into through-holes in a printed circuit board

Method for forming filled holes in multi-layer integrated circuit p...

Method of forming through-holes in printed wiring board

Circuit writer materials

Method of filling conductive material into through holes of printed...

Patents Applicationslast 30 patents

METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING

Carbon-Based Direct Plating Process

Carbon-Based Direct Plating Process

MAINTENANCE BOARD

SOLDER POT

ETCHING DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD U...

LOCALIZED JET SOLDERING DEVICE AND PARTIAL JET SOLDERING METHOD

POINT FLOW SOLDERING APPARATUS

METHOD FOR DISMOUNTING ELECTRONIC DEVICE

APPARATUS AND METHOD OF COATING FLUX

DEVICE AND METHOD FOR SELECTIVE SOLDERING

PRINTED CIRCUIT BOARD FABRICATION METHOD, PRINTED CIRCUIT BOARD OBT...

Method of Forming Solid Vias in a Printed Circuit Board

ELECTRONIC ASSEMBLY REMANUFACTURING SYSTEM AND METHOD

Methods and systems for selectively filling apertures in a substrat...

Method of mounting terminal on printed board, terminal mounted prin...

Method for local application of solder to preselected areas on a pr...