Treating the backside of the PCB

Industry

CPC
H05K2203/1581

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1581Treating the backside of the PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate with glass sheet, resin layer and through-glass via
- Patent number 11,276,584
- Issue date Mar 15, 2022
- Nippon Sheet Glass Company, Limited
- Keiji Tsunetomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical circuit board printer
- Patent number 10,917,975
- Issue date Feb 9, 2021
- Shenzhen Jingjiang Yunchuang Technology Co., Ltd.
- Xue-Qin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic assembly, and method for producing an optoelectronic...
- Patent number 10,834,809
- Issue date Nov 10, 2020
- Ledvance GmbH
- Georg Rosenbauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing glass substrate and glass sheet
- Patent number 10,418,256
- Issue date Sep 17, 2019
- Nippon Sheet Glass Company, Limited
- Keiji Tsunetomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible display module bonding method
- Patent number 10,405,436
- Issue date Sep 3, 2019
- SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
- Jianlei Zhu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic device, method for producing same, and circuit substrate
- Patent number 10,383,214
- Issue date Aug 13, 2019
- Stanley Electric Co., Ltd.
- Akihiko Hanya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assemblies and methods of assembling circuit boards a...
- Patent number 10,314,164
- Issue date Jun 4, 2019
- Astec International Limited
- Edgardo Hernando Vergara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive member, and conductive member
- Patent number 10,085,346
- Issue date Sep 25, 2018
- FUJIFILM Corporation
- Kenichi Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing multilayer substrate for having BGA-type c...
- Patent number 9,930,790
- Issue date Mar 27, 2018
- Denso Corporation
- Hirokazu Saitoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for producing an electrically conductive pattern on a s...
- Patent number 9,862,000
- Issue date Jan 9, 2018
- Stora Enso Oyj
- Petri Sirviö
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Applying apparatus
- Patent number 9,648,756
- Issue date May 9, 2017
- Fujitsu Ten Limited
- Tomohiro Yamakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electrically conductive pattern on a surface
- Patent number 9,352,351
- Issue date May 31, 2016
- Stora Enso Oyj
- Petri Sirviö
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Making multi-layer micro-wire structure
- Patent number 9,345,144
- Issue date May 17, 2016
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for removing an electronic component from a substrate
- Patent number 9,338,935
- Issue date May 10, 2016
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature triggering ejector mechanism for lock pin soldering typ...
- Patent number 9,314,861
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Xiaowei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning method, method of manufacturing organic field effect tra...
- Patent number 8,941,151
- Issue date Jan 27, 2015
- Sony Corporation
- Akihiro Nomoto
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for removing an electronic component from a substrate
- Patent number 8,925,170
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser-induced backside annealing using fluid absorber
- Patent number 8,658,260
- Issue date Feb 25, 2014
- Panasonic Corporation
- Jie Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB and camera module having the same
- Patent number 8,558,946
- Issue date Oct 15, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Woong-Tae Jung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a flexible electronic product
- Patent number 8,510,934
- Issue date Aug 20, 2013
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board
- Patent number 8,309,853
- Issue date Nov 13, 2012
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for assembling components having metal bonding pads
- Patent number 8,302,839
- Issue date Nov 6, 2012
- S.E.T.
- Gilbert Cavazza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus having a movable conductive ball...
- Patent number 8,299,628
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning method, method of manufacturing organic field effect tra...
- Patent number 8,277,900
- Issue date Oct 2, 2012
- Sony Corporation
- Akihiro Nomoto
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Patterning method, method of manufacturing organic field effect tra...
- Patent number 8,277,901
- Issue date Oct 2, 2012
- Sony Corporation
- Akihiro Nomoto
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 8,222,089
- Issue date Jul 17, 2012
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced transparent conductive coatings and methods for making them
- Patent number 8,105,472
- Issue date Jan 31, 2012
- Cima NanoTech Israel Ltd.
- Arkady Garbar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical equipment unit
- Patent number 8,107,242
- Issue date Jan 31, 2012
- Daikin Industries, Ltd,
- Akio Yoshimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 8,069,560
- Issue date Dec 6, 2011
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20240284599
- Publication date Aug 22, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20220272845
- Publication date Aug 25, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CIRCUIT BOARD PRINTER
- Publication number 20190357359
- Publication date Nov 21, 2019
- FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- XUE-QIN ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLIES AND METHODS OF ASSEMBLING CIRCUIT BOARDS A...
- Publication number 20190200452
- Publication date Jun 27, 2019
- Astec International Limited
- Edgardo Hernando Vergara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Assembly, and Method for Producing an Optoelectronic...
- Publication number 20180084633
- Publication date Mar 22, 2018
- LEDVANCE GmbH
- Georg Rosenbauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temperature Triggering Ejector Mechanism for Lock Pin Soldering Typ...
- Publication number 20140353360
- Publication date Dec 4, 2014
- International Business Machines Corporation
- Xiaowei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAKING MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20140306382
- Publication date Oct 16, 2014
- Ronald Steven Cok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HOT PRESS DEVICE AND HOT PRESSING METHOD
- Publication number 20130306712
- Publication date Nov 21, 2013
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-CHEN LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-Induced Backside Annealing Using Fluid Absorber
- Publication number 20130280440
- Publication date Oct 24, 2013
- PANASONIC CORPORATION
- Jie Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING METHOD, METHOD OF MANUFACTURING ORGANIC FIELD EFFECT TRA...
- Publication number 20130009223
- Publication date Jan 10, 2013
- SONY CORPORATION
- Akihiro Nomoto
- B82 - NANO-TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...
- Publication number 20120266459
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE ELECTRONIC PRODUCT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120006464
- Publication date Jan 12, 2012
- Jeroen van den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...
- Publication number 20110266039
- Publication date Nov 3, 2011
- SONY CORPORATION
- Katsuhiro TOMODA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...
- Publication number 20110143625
- Publication date Jun 16, 2011
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER EVIDENT PCBA FILM
- Publication number 20110116242
- Publication date May 19, 2011
- Seagate Technology LLC
- Michael Richard Fabry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bumping Electronic Components Using Transfer Substrates
- Publication number 20110092066
- Publication date Apr 21, 2011
- John Mackay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Fabricating Carrier Board Having No Conduction Line
- Publication number 20110061234
- Publication date Mar 17, 2011
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20110061907
- Publication date Mar 17, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PCB AND CAMERA MODULE HAVING THE SAME
- Publication number 20110063492
- Publication date Mar 17, 2011
- Samsung Electro-Mechanics CO., LTD.
- Woong-Tae JUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF
- Publication number 20110035939
- Publication date Feb 17, 2011
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS
- Publication number 20110023292
- Publication date Feb 3, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BEAM PROCESSING APPARATUS, BEAM PROCESSING METHOD, AND BEAM PROCESS...
- Publication number 20110017711
- Publication date Jan 27, 2011
- Satoki Nakada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD
- Publication number 20100230469
- Publication date Sep 16, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoaki IIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED TRANSPARENT CONDUCTIVE COATINGS AND METHODS FOR MAKING THEM
- Publication number 20100200407
- Publication date Aug 12, 2010
- CIMA NANO TECH ISRAEL LTD.
- Arkady Garbar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRICAL EQUIPMENT UNIT
- Publication number 20100177483
- Publication date Jul 15, 2010
- Akio Yoshimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD
- Publication number 20100116525
- Publication date May 13, 2010
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Plating Line Plating Method Using Current Transmitted From Ball...
- Publication number 20100075497
- Publication date Mar 25, 2010
- Chien-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR ASSEMBLING COMPONENTS HAVING METAL BONDING PADS
- Publication number 20090313816
- Publication date Dec 24, 2009
- Gilbert Cavazza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS
- Publication number 20090298278
- Publication date Dec 3, 2009
- Ping Liang TU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tape for heat dissipating member, chip on film type semiconductor p...
- Publication number 20090273076
- Publication date Nov 5, 2009
- Kyong-sei CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Treating the backside of the PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate with glass sheet, resin layer and through-glass via

Vertical circuit board printer

Optoelectronic assembly, and method for producing an optoelectronic...

Method for producing glass substrate and glass sheet

Flexible display module bonding method

Electronic device, method for producing same, and circuit substrate

Circuit board assemblies and methods of assembling circuit boards a...

Method for producing conductive member, and conductive member

Method for manufacturing multilayer substrate for having BGA-type c...

Arrangement for producing an electrically conductive pattern on a s...

Applying apparatus

Method for producing an electrically conductive pattern on a surface

Making multi-layer micro-wire structure

System for removing an electronic component from a substrate

Temperature triggering ejector mechanism for lock pin soldering typ...

Method of mounting devices in substrate and device-mounting substra...

Patterning method, method of manufacturing organic field effect tra...

Method for removing an electronic component from a substrate

Laser-induced backside annealing using fluid absorber

PCB and camera module having the same

Method of manufacturing a flexible electronic product

Flexible printed wiring board

Device for assembling components having metal bonding pads

Conductive ball mounting apparatus having a movable conductive ball...

Patterning method, method of manufacturing organic field effect tra...

Patterning method, method of manufacturing organic field effect tra...

Tape for heat dissipating member, chip on film type semiconductor p...

Enhanced transparent conductive coatings and methods for making them

Electrical equipment unit

Method of manufacturing multilayer wiring board

Patents Applicationslast 30 patents

Method for preparing novel material layer structure of circuit boar...

Method for preparing novel material layer structure of circuit boar...

VERTICAL CIRCUIT BOARD PRINTER

CIRCUIT BOARD ASSEMBLIES AND METHODS OF ASSEMBLING CIRCUIT BOARDS A...

Optoelectronic Assembly, and Method for Producing an Optoelectronic...

Temperature Triggering Ejector Mechanism for Lock Pin Soldering Typ...

MAKING MULTI-LAYER MICRO-WIRE STRUCTURE

HOT PRESS DEVICE AND HOT PRESSING METHOD

Laser-Induced Backside Annealing Using Fluid Absorber

PATTERNING METHOD, METHOD OF MANUFACTURING ORGANIC FIELD EFFECT TRA...

SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...

FLEXIBLE ELECTRONIC PRODUCT AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...

TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...

TAMPER EVIDENT PCBA FILM

Bumping Electronic Components Using Transfer Substrates

Method For Fabricating Carrier Board Having No Conduction Line

Printed circuit board and method of manufacturing the same

PCB AND CAMERA MODULE HAVING THE SAME

MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF

CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS

BEAM PROCESSING APPARATUS, BEAM PROCESSING METHOD, AND BEAM PROCESS...

CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD

ENHANCED TRANSPARENT CONDUCTIVE COATINGS AND METHODS FOR MAKING THEM

ELECTRICAL EQUIPMENT UNIT

FLEXIBLE PRINTED WIRING BOARD

Non-Plating Line Plating Method Using Current Transmitted From Ball...

DEVICE FOR ASSEMBLING COMPONENTS HAVING METAL BONDING PADS

METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS

Tape for heat dissipating member, chip on film type semiconductor p...