The present disclosure relates generally to fabrication techniques using laser processing. More particularly, the disclosure relates to annealing of transparent films deposited on transparent substrates by a laser-induced backside process.
This section provides background information related to the present disclosure which is not necessarily prior art.
Metal oxide thin films play a very important role in a variety of electronic devices that have transparent components, such as display devices, solar energy panels, and the like. For instance, the metal oxide thin film may define an operative part of a semiconductor device, such as the gate insulator and semiconductor of a thin film transistor, or it may define a conductive circuit path across the transparent face of the electronic device. In such applications, the metal oxide thin film, itself, may be transparent.
The conventional technique of solution-based processing for applying a metal oxide thin film to a transparent surface involves applying a coating of metal oxide ink to the transparent substrate and then annealing the metal oxide ink film by baking it in a furnace, as illustrated in
As an alternative to furnace annealing, some have tried using direct annealing using special lasers that direct optical energy onto the metal oxide ink film to cause localized heating as illustrated in
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
The present disclosure employs a new technique that allows inexpensive, user-friendly lasers, including diode lasers, to anneal a transparent metal oxide ink film upon a transparent substrate. The method uses a laser-induced backside process employing a laser that provides a laser beam at a wavelength that is substantially transmissive through the substrate and through the coating material that includes the metal oxide. The metal oxide coating material is applied to a first surface of the transparent substrate to define a coated surface. A containment vessel is then associated with the coated surface to define a fluid containment chamber that includes within its interior at least a portion of the coated surface. Into this containment chamber a fluid absorber material is introduced, so that the fluid absorber material contacts at least a portion of the coated surface. The fluid absorber is selected such that it is substantially absorptive at the predetermined laser wavelength.
A laser beam is then transmitted through the substrate and also through the coating material to strike the absorber material at the interface between coating material and absorber. The laser beam delivers optical energy to the absorber causing it to gain heat in the region where it is struck by the beam. This heat is then allowed to propagate to a localized region of the coating material in a quantity sufficient to anneal the coating material adjacent the absorber-coating interface through which the beam passed.
By controlling parameters such as beam profile shape, wavelength, duration of illumination (e.g., speed at which beam and workpiece substrate move relative to one another), laser power and absorber chemistry, very precise thin films can be applied to the transparent substrate in a highly controlled manner, using low-cost, user-friendly lasers or laser diodes. If desired, the absorber chemistry can include doping materials to be introduced into the thin film as part of the annealing process.
The disclosed technique thus provides a method of applying a film to a substrate that involves applying a coating material to a front side of a substrate; placing an absorber material in heat transfer proximity to a backside of the substrate; using a laser to heat an absorber material by transmitting the laser beam first through the coating material and then through the substrate to supply optical energy to the absorber material; and using the heat from the absorber material to alter the physical properties of the coating material such that the coating material forms a film adhered to the substrate.
Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
a and 4b are optical transmission graphs, showing the transmissive properties of some commonly used metal oxide thin films with which the disclosed technique may be employed;
a is a surface image photograph of a substrate onto which an Indium-Tin-Oxide (ITO) film of two horizontal stripes has been annealed using a 405 nm blue laser diode;
b is a surface image photograph of a substrate onto which an ITO film of two horizontal stripes has been annealed using a 1064 nm fiber laser;
c is a surface image photograph of a substrate onto which an ITO film of one horizontal stripe has been annealed using a 1064 nm fiber laser with a beam having a top hat profile;
a depicts a heat simulation model useful in understanding the thermodynamics of the backside laser annealing process;
b depicts the peak-temperature at the interface during scanning;
c depicts the rise/decay of peak-temperature;
a and 7b depict peak-temperature decay along the absorber-coating-substrate fabrication;
a and 8b depict prior art front side annealing processes illustrating direct annealing and indirect annealing, respectively;
a-10d illustrate how the metal oxide material is changed and volatile organic materials are driven off during the backside annealing process;
a-11d illustrate how the metal oxide material is doped using constituents of the absorber material in an alternate embodiment;
Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
Example embodiments will now be described more fully with reference to the accompanying drawings.
The laser-induced backside process according to the present disclosure is shown schematically in
A containment vessel 14 is associated with the coating material 12 to define a fluid containment chamber 16 that includes within its interior at least a portion of the coated surface of the substrate 10. An absorber material 18 is then introduced into chamber 16 so that it comes into contact with the coating material 12. The absorber material is preferably a fluid material, such as a liquid, that makes good thermal contact with the coating 12 and also inherently provides interstices through which outgassing organic byproducts may pass as the organic solvents are boiled away during the annealing process. The absorber material is composed of a heat absorbing material, such as dye or nanoparticles in a solvent. Carbon-based black-colored ink with an isopropanol solvent can serve as suitable absorber. Other materials and formulations may alternatively be used. The absorber material chosen may preferably be a good heat insulator, and preferably with a heat capacity that is similar to the coating material (metal oxide). The absorber material should also be selected so that it does not become substantially chemically altered at temperatures produced during laser heating.
To generate heat for the annealing process, a laser beam 20 is transmitted through the substrate 10 and also through the coating material 12 to strike the absorber material 18 at the interface between the coating material and the absorber. The laser beam thus strikes the absorber at the interface and supplies optical energy to the absorber, causing the absorber to gain heat in the region where struck. Energy is delivered to the absorber in this fashion until it attains a temperature sufficient to cause annealing within a localized region 24 of the coating material 12. Once a suitable annealing temperature has been achieved, the laser beam 20 may be terminated, or moved to a different region of the workpiece. In a typical implementation, the laser beam will be moved relative to the workpiece at a rate selected to control how long a particular region is heated. Because the absorber stores heat energy, heat will continue to flow from the absorber material to the localized region of the coating material even after the laser beam has been terminated; thus the annealing process continues even after the absorber material is no longer illuminated.
The substrate with coating is then installed in the containment vessel 14 as shown at 32 and the vessel is filled with a suitable quantity of absorber material 18 to substantially cover the ink film in the region where annealing is desired. The material chosen for the absorber may depend on the wavelength of the laser light chosen. In the illustrated embodiment, a carbon-based black-colored ink with IPA isopropanol solvent was used as the absorber material. This absorber material is substantially non-transmissive (opaque) at both 1064 nm and 405 nm laser wavelengths. These wavelengths were chosen because they correspond to readily available, low-cost, user-friendly lasers; the 1064 nm wavelength corresponding to a continuous wave (CW) fiber laser and the 405 nm wavelength corresponding to a blue diode laser. Of course, lasers of other wavelengths between 400 nm and 2000 nm may also be used. The ink may also be applied by spin coating onto the glass substrate.
Next, at step 34, the laser beam 20 is directed through the substrate and through the ink film so that the region adjacent the interface between the absorber and film is heated. The laser beam can be processed using optical systems to give the beam a desired profile shape and also to focus the beam at the desired heating point. As illustrated diagrammatically in
Referring to
If desired, the absorber material 18 may include a doping material 64. As shown in
After the annealing process is complete, the substrate and film coating are removed from the containment vessel as shown at 36. Only that portion of the ink film that was adjacent the heated absorber will have undergone the annealing process. The remainder of the ink film remains substantially as originally applied at step 30. This is shown in greater detail in
At step 38, the portions of the ink film that were not annealed (i.e., regions outside the local area 24) are removed by washing in a suitable solvent such as octane.
Referring to
By way of example, when using a 405 nm laser diode continuous wave (CW) laser, a Gaussian beam shape of 50 micrometers in diameter and a power of 0.5 watts will produce good results; alternatively, a 1D top-hat beam of approximately 500 micrometers by 50 micrometers at a power of 1.5 watts will also produce good results. By way of further example, when using a 1064 nm CW fiber laser, a Gaussian beam shape of 100 micrometers in diameter and a power of 3 watts will produce good results; alternatively, a 1D top-hat beam of approximately 800 micrometers by 90 micrometers at a power of 10 watts will also produce good results. Other laser wavelengths, other beam shapes and other power levels can be used.
The coating material (e.g., ink film) can be fabricated using a wide variety of different metal oxides, with the principal requirement being that the material should be optically transmissive at the laser wavelength. Thus selection of the metal oxide material is tied to proper selection of the laser wavelength, and vice versa. By way of illustration,
a, 5b and 5c show some test results useful in understanding how laser power and profile shape affect the results. In
By way of comparison,
There are a number of factors that can be controlled to achieve good results. These factors include: laser power, laser illumination time (which can be varied by controlling scan speed or rate at which workpiece moves relative to laser beam or vice versa), chemical makeup of absorber material (including material's optical absorption, heat capacity and thermal conductivity), and wavelength of laser light. As previously discussed, the absorber material is selected to absorb the laser energy and produce a rise in temperature at the interface where the coating material and absorber material meet. Preferably, the absorber material comprises a substance that is not, itself, chemically altered by the temperature rise.
The absorber is also preferably formulated or configured so that volatile organic solvents have an exit path through the absorber as the annealing process proceeds. In the illustrated embodiment, a fluid (liquid) absorber comprising carbon-based black ink is used. Other fluid materials having the desired absorbing properties may also be used, including dry powdered absorbers. Moreover, if desired, a solid absorber can be used; preferably, such solid absorber is equipped with pores or vent passages to allow the volatile organic solvents to escape.
a, 6b and 6c show simulation results on how heat generated by laser beam absorption by the absorber and then to the coating is carried out. As shown in
The laser beam 20 produces a heat bloom within the heating zone 80, which raises the temperature to the annealing temperature, which in turn causes a heat spike in the coating.
a and 7b show how the peak temperature decays across the absorber, metal oxide coating and substrate (glass) interfaces. The absorber-coating interface is shown at 22. As can be seen, the peak temperature of approximately 700 degrees Centigrade is delivered to the coating, with substantial fall-off in temperature in the absorber and substrate materials.
Backside laser annealing in accordance with the present disclosure offers distinct advantages, particularly where the substrate and coating materials are transparent. To illustrate this, refer first to
The backside annealing process of the present disclosure avoids this difficulty and is shown in
Selection of a suitable laser and laser beam wavelength depends on the optical properties of the coating material and substrate. Since most transparent metal-oxide (TMO) materials are transparent from 400 nm to 2000 nm, only ultraviolet or far infrared laser beams are absorbed directly by the metal-oxide. Such wavelengths would be suitable for front-side annealing, as depicted in
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.