Trench capacitors

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CPC
H01L29/945

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/945Trench capacitors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing capacitor structure
- Patent number 12,125,642
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor trench capacitor structure and manufacturing method t...
- Patent number 12,119,414
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,113,100
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongmin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor including stress-relief voids and methods of...
- Patent number 12,113,099
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,671
- Issue date Sep 24, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including deep trench capacitors and via contacts
- Patent number 12,074,227
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a capacitive element and corresponding...
- Patent number 12,057,513
- Issue date Aug 6, 2024
- STMicroelectronics (Rousset) SAS
- Christian Rivero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor inside gate cut trench
- Patent number 12,057,387
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D capacitor and method of manufacturing same
- Patent number 12,040,379
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric or anti-ferroelectric trench capacitor with spacers f...
- Patent number 12,040,378
- Issue date Jul 16, 2024
- Intel Corporation
- Nazila Haratipour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitors with continuous dielectric layer and methods of f...
- Patent number 12,034,086
- Issue date Jul 9, 2024
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming monolithic surge protect...
- Patent number 12,015,051
- Issue date Jun 18, 2024
- MACOM Technology Solutions Holdings, Inc.
- James J. Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,961,921
- Issue date Apr 16, 2024
- Lapis Semiconductor Co., Ltd.
- Hiroshi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,961,878
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor structure with hybrid filling layer
- Patent number 11,955,568
- Issue date Apr 9, 2024
- Murata Manufacturing Co., Ltd.
- Larry Buffle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for producing same
- Patent number 11,948,995
- Issue date Apr 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazushi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer trench capacitor structure
- Patent number 11,916,100
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Han Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,894,366
- Issue date Feb 6, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced ESR in trench capacitor
- Patent number 11,888,021
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Jing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion trap apparatus with integrated switching apparatus
- Patent number 11,876,092
- Issue date Jan 16, 2024
- Quantinuum LLC
- David Deen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided stacked DTC structure
- Patent number 11,869,988
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,862,667
- Issue date Jan 2, 2024
- Kabushiki Kaisha Toshiba
- Susumu Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,854,928
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for producing the same
- Patent number 11,854,890
- Issue date Dec 26, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Florian Krach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench pattern for trench capacitor yield improvement
- Patent number 11,855,133
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and semiconductor device
- Patent number 11,837,668
- Issue date Dec 5, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Chihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D capacitor and method of manufacturing same
- Patent number 11,837,646
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,830,909
- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Tomoyuki Ashimine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-digitated capacitor in flash technology
- Patent number 11,832,448
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20240387614
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS
- Publication number 20240372013
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240372014
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-CHIANG KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20240347619
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES
- Publication number 20240332433
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A TRENCH CAPA...
- Publication number 20240322001
- Publication date Sep 26, 2024
- SK keyfoundry Inc.
- Jong Hyuk OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT
- Publication number 20240321687
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266446
- Publication date Aug 8, 2024
- Kabushiki Kaisha Toshiba
- Yuhki FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT WITH A TRANSISTOR DEVICE AND A PROTECTION CIRCUIT
- Publication number 20240250678
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER
- Publication number 20240213377
- Publication date Jun 27, 2024
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Layout for Semiconductor Device
- Publication number 20240194730
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR
- Publication number 20240186318
- Publication date Jun 6, 2024
- STMicroelectronics (Rousset) SAS
- Christian RIVERO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING TRENCH MANUFACTURING
- Publication number 20240178055
- Publication date May 30, 2024
- STMicroelectronics (Crolles 2) SAS
- Thierno Moussa BAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
- Publication number 20240170584
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HSUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TRENCH CAPACITOR STRUCTURE
- Publication number 20240153987
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Han Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240147689
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED ESR IN TRENCH CAPACITOR
- Publication number 20240120368
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS
- Publication number 20240114692
- Publication date Apr 4, 2024
- Intel Corporation
- Nazila Haratipour
- G11 - INFORMATION STORAGE
Information Patent Application
BURIED TRENCH CAPACITOR
- Publication number 20240113102
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Umamaheswari Aghoram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240088033
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Kai Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH PATTERN FOR TRENCH CAPACITOR YIELD IMPROVEMENT
- Publication number 20240088210
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR
- Publication number 20240063251
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tao-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Deep Trench Capacitor with Reduced Deforma...
- Publication number 20240047552
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240030359
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20230402445
- Publication date Dec 14, 2023
- Fuji Electric Co., Ltd.
- Yoshiaki TOYODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS
- Publication number 20230395321
- Publication date Dec 7, 2023
- Qorvo US, Inc.
- Tarak A. Railkar
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS
- Publication number 20230387330
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS

Trench capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High capacitance MIM device with self aligned spacer

Method of manufacturing capacitor structure

Semiconductor trench capacitor structure and manufacturing method t...

Semiconductor structure and method for manufacturing semiconductor...

Deep trench capacitor including stress-relief voids and methods of...

Semiconductor device

Semiconductor device including deep trench capacitors and via contacts

Integrated circuit including a capacitive element and corresponding...

Decoupling capacitor inside gate cut trench

3D capacitor and method of manufacturing same

Ferroelectric or anti-ferroelectric trench capacitor with spacers f...

Trench capacitors with continuous dielectric layer and methods of f...

Semiconductor device and method of forming monolithic surge protect...

Semiconductor device and manufacturing method for semiconductor device

Interconnect layout for semiconductor device

Trench capacitor structure with hybrid filling layer

Capacitor and method for producing same

Multi-layer trench capacitor structure

Trench capacitor assembly for high capacitance density

Reduced ESR in trench capacitor

Ion trap apparatus with integrated switching apparatus

Double-sided stacked DTC structure

Capacitor

Semiconductor package and manufacturing method thereof

Capacitor and method for producing the same

Trench pattern for trench capacitor yield improvement

Semiconductor element and semiconductor device

3D capacitor and method of manufacturing same

Semiconductor device

Inter-digitated capacitor in flash technology

Patents Applicationslast 30 patents

DOUBLE-SIDED STACKED DTC STRUCTURE

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS

SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...

3D CAPACITOR AND METHOD OF MANUFACTURING SAME

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A TRENCH CAPA...

BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

SEMICONDUCTOR DEVICE

ELECTRONIC CIRCUIT WITH A TRANSISTOR DEVICE AND A PROTECTION CIRCUIT

TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER

Interconnect Layout for Semiconductor Device

INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR

INSULATING TRENCH MANUFACTURING

SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...

MULTI-LAYER TRENCH CAPACITOR STRUCTURE

DEEP TRENCH CAPACITOR AND METHOD FOR FORMING THE SAME

REDUCED ESR IN TRENCH CAPACITOR

INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS

BURIED TRENCH CAPACITOR

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

TRENCH PATTERN FOR TRENCH CAPACITOR YIELD IMPROVEMENT

TRENCH CAPACITOR

Structure and Method for Deep Trench Capacitor with Reduced Deforma...

SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS

SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS