Tungsten [W] as principal constituent

Industry

CPC
H01L2224/29684

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29684Tungsten [W] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 11,682,553
- Issue date Jun 20, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Hasan Naser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating and bonding substrates
- Patent number 9,358,765
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20210143006
- Publication date May 13, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hasan NASER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

Tungsten [W] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures and methods for forming the same

Method of manufacturing an electronic device

Method for coating and bonding substrates

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Electronic component mounting structure

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Semiconductor device, circuit board, electro-optic device, electron...