Tungsten (W) as principal constituent

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H01L2224/45684

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45684Tungsten (W) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,929,262
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,651,975
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 10,770,311
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 10,374,136
- Issue date Aug 6, 2019
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 10,115,876
- Issue date Oct 30, 2018
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 9,583,688
- Issue date Feb 28, 2017
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating stacked semiconductor system with encapsulat...
- Patent number 8,404,523
- Issue date Mar 26, 2013
- Micron Technoloy, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip stacked body and method of manufacturing the same
- Patent number 8,394,678
- Issue date Mar 12, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having stacked components with encapsul...
- Patent number 8,217,510
- Issue date Jul 10, 2012
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
System with semiconductor components having encapsulated through wi...
- Patent number 8,120,167
- Issue date Feb 21, 2012
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board for harsh environments
- Patent number 8,076,587
- Issue date Dec 13, 2011
- SIEMENS ENERGY, INC.
- David J. Mitchell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body of semiconductor chips including pads mutually conne...
- Patent number 8,058,717
- Issue date Nov 15, 2011
- Shinko Electric Industries Co., Ltd.
- Akihito Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component having encapsulated...
- Patent number 7,883,908
- Issue date Feb 8, 2011
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Wire bond method for angularly disposed conductive pads and a devic...
- Patent number 7,772,045
- Issue date Aug 10, 2010
- Randy Wayne Bindrup
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor components having encapsulated through wire interconn...
- Patent number 7,659,612
- Issue date Feb 9, 2010
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 7,256,488
- Issue date Aug 14, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 7,049,694
- Issue date May 23, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 6,992,377
- Issue date Jan 31, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230245902
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200381267
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...
- Publication number 20140264426
- Publication date Sep 18, 2014
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
System With Semiconductor Components Having Encapsulated Through Wi...
- Publication number 20110024745
- Publication date Feb 3, 2011
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP LAMINATED BODY
- Publication number 20100320584
- Publication date Dec 23, 2010
- Shinko Electric Industries Co., Ltd.
- Akihito TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100133677
- Publication date Jun 3, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board for Harsh Environments
- Publication number 20100078202
- Publication date Apr 1, 2010
- SIEMENS ENERGY, INC.
- David J. Mitchell
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method For Fabricating Semiconductor Component Having Encapsulated...
- Publication number 20100047934
- Publication date Feb 25, 2010
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor components and systems having encapsulated through wi...
- Publication number 20070246819
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor package with crossing conductor assembly and method o...
- Publication number 20060163716
- Publication date Jul 27, 2006
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with crossing conductor assembly and method o...
- Publication number 20060065966
- Publication date Mar 30, 2006
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with crossing conductor assembly and method o...
- Publication number 20050189643
- Publication date Sep 1, 2005
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Tungsten (W) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stack package and methods of manufacturing the same

Stack package and methods of manufacturing the same

Stack package and methods of manufacturing the same

Light emitting apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Bonding wire for semiconductor device

Power semiconductor device, method of manufacturing the device and...

Semiconductor module system having encapsulated through wire interc...

Method for fabricating a through wire interconnect (TWI) on a semic...

Through wire interconnect (TWI) having bonded connection and encaps...

Connecting wire and method for manufacturing same

Method for fabricating stacked semiconductor system with encapsulat...

Semiconductor chip stacked body and method of manufacturing the same

Semiconductor module system having stacked components with encapsul...

System with semiconductor components having encapsulated through wi...

Semiconductor device bonding wire and wire bonding method

Printed circuit board for harsh environments

Laminated body of semiconductor chips including pads mutually conne...

Method for fabricating semiconductor component having encapsulated...

Wire bond method for angularly disposed conductive pads and a devic...

Semiconductor components having encapsulated through wire interconn...

Semiconductor package with crossing conductor assembly and method o...

Semiconductor package with crossing conductor assembly and method o...

Semiconductor package with crossing conductor assembly and method o...

Patents Applicationslast 30 patents

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

LIGHT EMITTING APPARATUS

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

Semiconductor Module System Having Stacked Components With Encapsul...

System With Semiconductor Components Having Encapsulated Through Wi...

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

SEMICONDUCTOR CHIP LAMINATED BODY

SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

Printed Circuit Board for Harsh Environments

Method For Fabricating Semiconductor Component Having Encapsulated...

Semiconductor components and systems having encapsulated through wi...

Semiconductor package with crossing conductor assembly and method o...

Semiconductor package with crossing conductor assembly and method o...

Semiconductor package with crossing conductor assembly and method o...